Siemens Aktiengesellschaft

Infineon Technologies Ag

Rolls-royce Deutschland Ltd & Co. Kg

Bsh Hausgerate Gmbh

Contitech Antriebssysteme Gmbh

Target Robotics S.a. De C.v.

Martin Franke

Stefan Nerreter

Bernd Müller

Rüdiger Knofe

Peter Frühauf

Klaus Wilke

Jörg Strogies

Rene Blank

Ulrich Wittreich

Axel Beier

Tobias Happel

Nora Jeske

Helmut Nowsch

Matthias Heimann

Svenja Rosenbohm

Michael Niedermayer

Andre Matthias Kwiatek

Volker Türck

Manfred Zäske

Carsten Borwieck

Mathias Miedreich

Luisa Jentsch

Oliver Börner

Peter Steer

Carlos Sebastian Videla

Gerardo Daniel Jimenez Sanchez

Jose Luis Villalon Baltazar

The invention relates to a circuit arrangement, comprising at least one wiring carrier plate (), characterized by at least one separating element () formed in the wiring carrier plate (), which separating element divides the wiring carrier plate () into sections separated by the separating element (), wherein the transfer of vibrations from one section to another section is at least partially decoupled and/or damped by the separating element (). The invention further relates to a converter having such a circuit arrangement, and to an aircraft having a converter. The converter can comprise capacitor stacks () arranged on the wiring carrier plate (), and power semiconductors ().

Vibration-damped circuit arrangement, converter, and aircraft having such an arrangement

Various embodiments include a semiconductor component comprising: a first carrier part; a second carrier part arranged opposite the first carrier part; a semiconductor element arranged between the first carrier part and the second carrier part; a contact surface arranged on one of the parts; a contact sleeve arranged on one of the carrier parts opposite the contact surface; and a contact pin with, at one axial end, an end face providing an electrical contact connection of the contact surface and, in a region averted from said axial end, a connection region for the connection of the contact pin with the contact sleeve by means of press fitting. At least one of the first carrier part or the second carrier part comprises a printed conductor connected to the contact surface and/or to the contact sleeve.

Semiconductor component and method for producing same

Various embodiments include an electrical assembly with: an electronic switching element electrically contacted on an underside and arranged on a flexible first wiring support; wherein the electronic switching element is electrically contacted on an upper side lying opposite the lower side; and a second wiring support arranged lying opposite the first wiring support on the upper side electrical contacting area of the electronic switching element. The first wiring support and the second wiring support each comprise a permanently elastic, electrically insulating, thermally conductive material.

Electrical assembly

Examples include cooling members for electronic components and/or methods for producing cooling members. The members may include: an assembly side for an electronic component and an upper side opposite the assembly side; at least one cooling chimney extending through the cooling member away from the assembly side which leads to an outlet opening in the upper side of the cooling member; and a number of cooling channels. The cooling channels may have a smaller cross-section than a cross-section of the cooling chimney which lead from inlet openings in the upper side of the cooling member to the cooling chimney.

Pourous heat sink with chimney

A display element and a display device in which the display element is mounted. The display may be a variable message sign. The sign includes a tube-like housing in which lenses and apertures can be disposed. The light exiting a light source is emitted via an emitting surface, by way of which an illuminated traffic sign results from interacting with further display elements. The light source and the optical elements are disposed at different heights in the horizontally oriented housing. The optical axes can thereby extend horizontally, or the optical elements can lie on a main axis which is tilted downward in an radiation direction. In both cases, sunlight impinging from above at an angle advantageously falls on the LED to a slight degree, by way of which the phantom light phenomenon is minimized.

Optical display element and display device

In a method for the production of optical bands with several optical fibers, the surface of the optic fibers in said bands is treated such as to increase the optical damping in sections of the optic fibers. The generated damping may be reliably adjusted, whereby during (or after) the processing of the surfaces a measuring light is introduced into the fiber optic and the light output at the other end of the band is measured by means of a sensor such as a CCD camera. Possible production errors can thus be compensated for during the production process, for example, by an increased process time for the optic fiber. Optical sensor bands can be produced by the above method for application in the bumpers of motor vehicles as recognition sensors for the impact of a pedestrian. Other applications in which the bending of a sensor band is to be determined by optical means are also envisaged.

Method for production of a band with several parallel optical fibers

A photodiode configuration having at least two photodiodes is described. Accordingly, the photodiodes are formed in a symmetrical configuration on a common carrier, and electrical contacts are situated in a region between the photodiodes. It is therefore possible, in particular, to use monitor diode configurations of identical construction at the two sides of a laser diode array. Accordingly, a laser diode configuration having a correspondingly configuration having a photodiode configuration is further disclosed. Finally, a method for connecting a photodiode configuration to a submount is specified.

Photodiode configuration having two photodiodes, a laser diode configuration having the photodiode configuration, and method for connecting the photodiode configuration to a substrate

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Berlin, Germany

Martin Franke