Harris Corporation

Other

Martin E Walter

Jack H Linn

David C Paul

Christopher M Angelucci

Michael L Boyer

Christopher J Ryan

David A Decrosta

Mike M Higley

Craig S Arruda

Amit Sinha

Implants for use in the spinal column are disclosed. The implants comprise a bone allograft coupled with a non-allogenic plate. The plate has ends that fasten to opposing spine segments, and an intermediate portion that engages the allograft using deformable fingers, or with a hollow portion sized to receive and hold part of the allograft, or with fixed tabs. Methods of using the implants are also disclosed.

Laminoplasty implants and methods of use

A gas phase plasma cleaning method and apparatus is shown for removing contaminants from the surface of exposed metallic parts on integrated circuits (IC's). A two step method is shown using a defined gas mixture of argon and oxygen, and ammonia and hydrogen. The gases are separately introduced into a plasma chamber. The argon oxygen mixture is used to remove carbonatious material by chemical reaction and by milling. The ammonia hydrogen mixture is introduced to chemically remove and reduce oxides and phosphates. Surface energies are increased to permit improved adhesion of inks. Additionally, intermediate oxides formed after the plasma exposure prevent complete regrowth of the normally passivating oxide layer.

Plasma cleaning method for improved ink brand permanency on IC packages

A process for removing unwanted contaminant metallic oxide from the surface of a nickel branding layer of an electronic circuit package, in order to enhance the affinity of a layer of phenolic branding ink to the surface of the metallic branding layer involves treating the surface of the metallic branding layer with a hydrogen-containing, chemical reducing gas phase ambient, so that oxygen within the surface oxide chemically combines with the hydrogen component within the ambient, so as to form readily removable water. The surface of the metallic branding layer is thereby substantially free of surface oxide, providing a greater surface area of metallic-ink bonding sites. As a consequently, a subsequently deposited layer of branding ink strongly adheres to the surface of the nickel and is not readily removed during further cleaning of the circuit package.

Gas phase chemical reduction of metallic branding layer of electronic

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Palm Bay, FL, United States of America

Martin E Walter