Gm Global Technolgoy Operations, Inc.

Martin C Steele

Jayant K Bhagat

In a preferred embodiment, the etch rate of a silicon-containing surface subjected to a RF discharge plasma containing reactive etching species is selectively affected by electrically insulating the surface from the plasma-generating RF power source and by applying to the surface a predetermined time-constant electrical potential. The applied potential apparently interacts with the plasma constituents in the immediate vicinity of the surface to alter the concentration of reactive species and thereby change the rate of attack of the plasma upon the surface. The applied potential, depending upon its polarity and strength, is useful to selectively increase or decrease the etch rate of the desired surface exposed to a predetermined plasma without significantly interfering with the overall RF plasma discharge.

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Bloomfield Hills, MI, United States of America

Martin C Steele