Nordson Corporation

Martin Bugg

David T Lilley

Robert John Sykes

Robert Brian Deards

Ian Christopher Mayes

Robert Deards

Ian Chritopher Mayes

A bond test apparatus comprises a test tool assemblycomprising a test toolconfigured to contact a bond during a bond test, a flexurecoupled to the test tool assembly, and a sensor. The sensor is configured to provide a measurement of a displacement of a first end of the flexurerelative to a second end of the flexure on application of a force to the flexure, and a processor is configured to receive a displacement signal from the sensor and, based on the displacement signal and optionally a known stiffness of the flexure, to determine the force on the flexure. A cartridge for a bond test apparatus, a method of measuring a force in a bond test apparatus, and a method of measuring the closing force on the jaws of a bond test tool are also provided.

Bond test apparatus and method

A bond test apparatus, and a cartridge and a light guide for the bond test apparatus are disclosed. The bond test apparatus includes a stage for supporting a bond for testing, a test tool having a test tool tip, a drive mechanism for providing relative movement between the stage and the test tool during the bond test, one or more light sources fixed relative to the test tool, a light guide for directing light to the test tool tip. The cartridge includes a test tool having a test tool tip to contact the bond during a bond test, one or more light sources fixed to the test tool, and a light guide for directing light s to the test tool tip. The light guide includes a tubular body to fit around a test tool, and to direct light, using total internal reflection, from a proximal end of the light guide to a distal end of the light guide.

Bond test apparatus and bond test cartridge with integrated illumination system

A cartridge suitable for use in a bond testing machine includes a plurality of a different test tools. A rotary mechanism is provided and each of the plurality of different test tools is mounted to the rotary mechanism angularly spaced from one another. A drive unit is coupled to the rotary mechanism and is configured to rotate the rotary mechanism to move each of the plurality of different test tools to and from a use position. An air interface receives compressed air from a corresponding air interface on a positioning assembly of the bond testing machine.

Bond testing machine and cartridge for a bond testing machine comprising a plurality of test tools

A testing apparatus for testing the strength of a material connection to a substrate. A drive mechanism couples a test tool mount to a main body and allows for relative movement between the test tool mount and the main body in an axial direction. A biasing element is coupled between the main body and the test tool mount, that, in operation, biases the test tool mount relative to the main body in an axial direction. The biasing element is switchable between a first state in which the test tool mount is biased either toward or away from the substrate and another state in which the biasing element provides one of: no biasing force to the test tool mount toward or away from the substrate, or a biasing force in a direction opposite to the direction of bias applied in the first state.

Bond strength tester with switchable backlash control

A bond strength testing apparatus comprising a main body, a test tool mount for holding a test tool, and an axial drive mechanism including a screw and nut assembly. The drive mechanism couples the test tool mount to the main body and allows for relative movement between the test tool mount and the main body in an axial direction. A backlash control element is coupled to the main body and the test tool mount, and, in operation, biases the test tool mount relative to the main body in an axial direction. The backlash control element is switchable between a first state in which the test tool mount is biased in a first axial direction by the backlash control element, and a second state in which either the test tool mount is biased in a second axial direction by backlash control element, or the backlash control element applies no biasing force to test tool mount. The apparatus can be automated to apply the appropriate backlash control for a particular, selected test type.

A shear test device for testing the strength of attachment between a bond and an electronic substrate. The device incorporates a clamping mechanism and a shear test tool that are mounted on a baseplate. During a set-up procedure, the shear test tool is movable relative to the baseplate. During a test procedure, the shear test tool is clamped by the clamping mechanism in a fixed position relative to the baseplate. At least one abutment is provided that is fixed in position relative to the baseplate. During the test procedure, a drive mechanism provides relative movement between the shear test tool and the bond to cause the shear test tool to shear the bond off the substrate. The at least one abutment provides an additional clamping force on the test tool while the test tool is shearing the bond off of the substrate.

Clamping mechanism for shear testing apparatus

A shear test device for testing the strength of attachment between a bond and an electronic substrate. The device incorporates a clamping mechanism and a shear test tool that are mounted on a baseplate. During a set-up procedure, the shear test tool is movable relative to the baseplate. During a test procedure, the shear test tool is clamped by the clamping mechanism in a fixed position relative to the baseplate. At least one abutment is provided that is fixed in position relative to the baseplate. During the test procedure, a drive mechanism provides relative movement between the shear test tool and the bond to cause the shear test tool to shear the bond off the substrate. The at least one abutment provides an additional clamping force on the test tool while the test tool is shearing the bond off of the substrate. Strain gauges associated with the shear test tool provide signals to an electric circuit indicating the strength of attachment between the bond and the substrate.

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Ipswich, United Kingdom

Martin Bugg