Finisar Corporation

Martin Andre Kalberer

Hongyu Deng

Maziar Amirkiai

Darin James Douma

Yunpeng Song

The 'Linh Nguyen

Heating resistor used to control laser operation. A laser package, such as a Transmitter Optical Subassembly (TOSA) includes a substrate. A laser is disposed on the substrate. A resistive heating element is disposed on the substrate with the laser. Control circuitry is connected to the resistive heating element. The control circuitry is configured to cause current flow through the resistive heating element based on temperature conditions. Current flow through the resistive heating element causes an increase in the operating temperature of the laser. This can be used to increase the effective operating temperature range of a laser.

Resistive heating element for enabling laser operation

An example embodiment includes a TO can including a header, an RF pin opening, an internal volume, an RF pin, a submount, and a flex circuit. The header defines the RF pin opening. The internal volume is defined by a TO can housing and an interior header surface. The RF pin extends through the RF pin opening such that a first surface connection is located in the internal volume and a second surface connection is located outside of the internal volume and extends past an exterior header surface. The submount is located in the internal volume and the submount includes a submount trace. The submount trace includes a pin connection portion in-line with the RF pin and electrically coupled to the first surface connection. The flex circuit includes a flex trace further including a flex trace connection in-line with the RF pin and electrically coupled to the second surface connection.

Transistor outline can with in-line electrical couplings

A low inductance structure for improving the integrity of data signals carried in an optical subassembly is disclosed. In one embodiment the optical subassembly comprises a housing containing a lens assembly and an optical isolator. The optical subassembly further includes an optoelectronic package having a base defining a mounting surface that cooperates with a cap to define a hermetic enclosure. First and second signal leads of the subassembly include ends that extend into the hermetic enclosure. A submount is disposed on the base mounting surface. A low inductance structure is integrally formed with the submount and includes a dielectric body interposed between the first and second leads. The body includes shaped edges and conductive pad structures in electrical communication with conductive traces disposed on the submount. Each pad structure is also in electrical communication with a respective one of the first and second signal leads via a plurality of wirebonds.

Low inductance optical transmitter submount assembly

A header assembly for extended temperature optical transmitters is disclosed. The header assembly may include a hermetic enclosure and a header base with an interior surface. A plurality of conductive leads penetrate from the outer portion of the header assembly to the interior surface. A thermoelectric cooler ('TEC') having a planar configuration and a thickness not exceeding 500 microns is positioned adjacent to the interior surface of the header assembly, the TEC being in thermal communication with the header base and a mounting surface. A submount, on which a laser diode is positioned, is in thermal communication with the mounting surface of the TEC. In this manner, the TEC may be configured affect a selective transfer of heat to the laser diode and transfer of heat away from the laser diode. In some embodiments, the header assembly is configured to operate at optical data transmission rates of 10 Gbps or higher in such extended ambient temperatures.

Header assembly for extended temperature optical transmitter

In one example, a header assembly for use in a communication device has a base that includes a plurality of single ports through which a corresponding plurality of leads extends. The leads are retained in their respective single ports by a retainer material. Additionally, the base includes one or more plural ports through which two or more leads extend.

Growing community of inventors

Redwood City, CA, United States of America

Martin Andre Kalberer