Varian Associates, Inc.

Other

Rf Science & Technology Inc.

Martin A Hutchinson

Frederick T Turner

R Howard Shaw

George L Coad

Lawrence T Lamont, Jr

Kenneth E Anderson

David J Harra

Phillip B Nicholson

Adolphus E McClanahan

Mark Norman Iverson

David James Harra

Rick Eugene Sanner

Peter F Mastin

Systems and methods for non-invasively scanning and analyzing one or more characteristics of a sample utilizing electromagnetic radiation are described. More particularly, the systems and methods utilize an electromagnetic radiation source connected to a transmitter and an analyzer connected to a receiver. A sample to be analyzed is placed between the transmitter and receiver in a variety of different manners and a frequency sweep of electromagnetic radiation is transmitted through the sample to create a series of spectral data sets that are used to create one or more composite spectrograms, which are then analyzed to determine one or more characteristics of the sample. A magnetic field can alternatively be applied around the transmitter, receiver and sample to enhance some characteristic analysis applications. Samples include inert and living items, and the characteristics include a wide variety of different applications.

Non-invasive scanning apparatuses

An apparatus for releasably clamping a substrate to a support platform, or other support means, at a face of the substrate is described. In one embodiment, a retractable clamp holds a substrate near its edges on a support platform when the clamp is in its fully extended position. One or more leaf springs are mounted to the clamp and apply force to the substrate at respective points in the event the substrate adheres to the clamp, thereby releasing the substrate from the clamp. In a preferred embodiment of the present invention, one or more activators are positioned in cooperative relationship to the leaf springs to cause the leaf springs to retract into recesses in the clamp when the clamp is extended against the substrate. In their retracted position, the leaf springs do not contact the substrate so as to minimize the generation of particle contamination and the chance of the release leaf springs themselves adhering to the substrate.

Clamp with wafer release for semiconductor wafer processing equipment

An apparatus for releasably clamping a substrate to a support platform, or other support system, at a face of the substrate is described. In one embodiment, a retractable clamp holds a substrate near its edges on a support platform when the clamp is in its fully extended position. One or more leaf springs are mounted to the clamp and apply force to the substrate at respective points in the event the substrate adheres to the clamp, thereby releasing the substrate from the clamp. In a preferred embodiment of the present invention, one or more activators are positioned in cooperative relationship to the leaf springs to cause the leaf springs to retract into recesses in the clamp when the clamp is extended against the substrate. In their retracted position, the leaf springs do not contact the substrate so as to minimize the generation of particle contamination and the chance of the release leaf springs themselves adhering to the substrate.

Semiconductor wafers having patterns of steps and grooves defining microcircuit elements thereon are coated with metallic film by supporting the wafers individually adjacent a respective ring-shaped sputtering source in stationary relationship thereto. To effectuate such individual wafer processing on a continuous basis and preserve the evacuated argon environment, a vacuum chamber sputter coating apparatus is provided which has a number of work stations therein, at least one of which includes said ring-shaped sputtering source. Also included is a load lock, and an intermittently rotting vertical plate-like wafer carrier means therewithin positioned closely adjacent the chamber entrance, and carrying wafers in turn from the load lock to the work stations. The carrier includes apertures each accepting a wafer therewithin in an upright position, with the wafers edgewise resiliently supported by clip means, without the use of any externally-originating supports such as platens. Both surfaces of wafer can be accessed by processing equipment, for example, heating or cooling means at some of the work stations. Only a few wafers inside the chamber are at risk at any one time, and introduction of contaminants, debris, as well as disturbances to the chamber environment minimized.

Wafer coating system

Semiconductor wafers having patterns of steps and grooves defining microcircuit elements thereon are coated with metallic film by supporting the wafers individually adjacent a respective ring-shaped sputtering source in stationary relationship thereto. To effectuate such individual wafer processing on a continuous basis and preserve the evacuated argon environment, a vacuum chamber sputter coating apparatus is provided which has a number of work stations therein, at least one of which includes said ring-shaped sputtering source. Also included is a load lock; and an intermittently rotating vertical plate-like wafer carrier means therewithin positioned closely adjacent the chamber entrance, and carrying wafers in turn from the load lock to the work stations. The carrier includes apertures each accepting a wafer therewithin in an upright position, with the wafers edgewise resiliently supported by clip means, without the use of any externally-originating supports such as platens. Both surfaces of the wafer can be accessed by processing equipment, for example, heating or cooling means at some of the work stations. Only a few wafers inside the chamber are at risk at any one time, and introduction of contaminants, debris, as well as disturbances to the chamber environment are minimized.

A sputter coating module for a multifunction processing machine is provided in which the supporting mechanism for the workpiece can be isolated from the sputtering source, the pumps and other processing apparatus for cleaning without exposing the entire machine to atmosphere. The supporting mechanism which is rotatable from the horizontal to the vertical is hollow and mounted on hollow vacuum-sealed trunnions to allow passage of water, argon, and dry-nitrogen or air at atmospheric pressure into the interior of the supporting mechanism.

Sputter module for modular wafer processing machine

Semiconductor wafers having patterns of steps and grooves defining microcircuit elements thereon are coated with metallic film by supporting the wafers individually adjacent a respective ring-shaped sputtering source in stationary relationship thereto. Within a short deposition time of approximately one minute, good uniformity of deposition across the main wafer plane is obtained by maintaining source-to-wafer spacing less than the diameter of the source, and an effective source diameter (D.sub.s) larger than the diameter of wafer (D.sub.w) with the coating being performed within an argon environment of 2 to 20 microns pressure. Good step coverage across all surfaces of steps and grooves is likewise obtained, and is further enhanced by confining the source-to-wafer spacing ranges to certain values within about 0.4 D.sub.s to 0.9 D.sub.s and the wafer diameter to certain values up to about 0.7 D.sub.s. To effectuate such individual wafer processing on a continuous basis and preserve the evacuated argon environment, a vacuum chamber sputter coating apparatus is provided which has a number of work stations therein, at least one of which includes said ring-shaped sputtering source. Also included is a load lock; and an intermittently rotating vertical plate-like wafer carrier means therewithin positioned closely adjacent the chamber entrance, and carrying wafers in turn from the load lock to the work stations. The carrier includes apertures each accepting a wafer therewithin in an upright position, with the wafers edgewise resiliently supported by clip means, without the use of any externally-originating supports such as platens. A closure member within the chamber is movable against the plate opposite the chamber entrance to close off the plate aperture from the chamber environment during loading and unloading of a wafer, and a door is provided to close the chamber opening and thus complete a thin low-volume load lock. The door is also provided with vacuum means to grasp a wafer presented vertically by a blade-like elevator which cooperates with a cassette and conveyor moving the cassette along a horizontal path below the chamber entrance. The cassette holds wafers vertically, and the blade passes therethrough to lift individual wafers edgewise to the door vacuum means. Closure of the door inserts the wafer into the clip means within the carrier and chamber, and the reverse operation extracts a wafer previously coated at a sputtering work station. Both surfaces of the wafer can be accessed by processing equipment, for example, heating or cooling means at some of the work stations. Only a few wafers inside the chamber are at risk at any one time, and introduction of contaminants, debris, as well as disturbances to the chamber environment are minimized.

A modular wafer processing system requires a gate valve of minimum thickness. A gate valve is provided in which the gate is an assymetric wedge on an assymetrically mounted drive shaft.

Gate valve for wafer processing system

An elevator structure is actuated to remove wafers individually out of a storage cassette to an elevated delivery position. The elevator is a lift blade with an arcuate upper end shaped to match the curvature of the wafers, and a groove within this end adapted to match the thickness of a wafer and retain a wafer edgewise. A wafer-holding chuck on a chuck assembly is adapted to receive a wafer from the elevator when the elevator is in the elevated delivery position. The chuck assembly is movable from the delivery position to a remote position where the chuck presents the wafer to a support member. The support member is provided with an aperture and a plurality of deformable wafer-holding clips spaced around the aperture. The chuck assembly includes a pneumatic cylinder capable of contacting a portion of each clip to urge same to an open position. The invention includes an arrangement in which the chuck is mounted on a chuck assembly in the form of a door for sealing an opening in a process chamber.

A magnetron sputter device includes separate first and second targets over which first and second discharges are formed by separate ionizing electric fields and separate confining magnetic fields. The separate confining magnetic fields include first and second magnetic circuits through the first and second targets, respectively. The first magnetic circuit includes first and second pole pieces for coupling magnetic flux from a first magnetic field source to the first target. The second magnetic circuit includes the second pole piece and a third pole piece for coupling magnetic flux from a second magnetic field source to the second target. The magnetic circuits and the magnetic field sources are arranged so that magnetic fluxes from the first and second magnetic field sources combine in the second pole piece.

Magnetron sputter device using the same pole piece for coupling separate

The system for rotating the transfer plate of a coating system in a vacuum chamber consists of a transfer plate driver assembly on the outside of the chamber at the axis and a transfer plate rotator assembly inside the chamber. The driver assembly consists of a pneumatic actuator for linear motion, a barrel cam which translates the linear motion into rotary motion with high torque at starting and stopping positions, and a rotary feedthrough all in a structural housing. The rotator assembly comprises a central hub with means for supporting the end walls, a transfer plate hub assembly and a ratchet arm connected to the rotary feedthrough. As the pressure plate assembly is drawn back by the ram, it in turn draws back the transfer plate and engages the ratchet arm with the transfer plate hub. The actuator then rotates the transfer plate. The ram then reverses direction, the ratchet arm disengages and is returned to its initial position.

Transfer plate rotation system

A method of sputter depositing a desired film thickness profile on a substrate is accomplished by depositing material onto a substrate at spaced apart coating stations whereby a substrate at any of said stations is not coated by the sputter coating action at any of the other sputter stations. The substrate is held stationary during complete sputtering at each station. A blocking shield is placed in fixed position between the substrate and the sputter coating source at one or more of the stations. The duration of sputter coating time at one station may be different than at another station.

Blocking shield and method for contouring the thickness of sputter

The arbitrary contouring of thickness of a sputter-deposited film is made possible by a blocking means having a primary blocking shield and an ancillary blocking shield. The primary blocking shield intercepts atoms sputtered directly from the cathode target by line-of-sight transport. The ancillary blocking shield extends downwardly from the side of the primary blocking shield which is placed closest to the substrate. The ancillary blocking shield intercepts atoms sputtered from the cathode which by intervening gas collisions have been redirected to travel underneath the primary blocking shield. Precise tailoring of the thickness profile of the coating on the substrate is thereby provided and the quality of the composite film is maintained. The method for contouring the thickness of sputter coated layers comprises sputter coating portions of the film at successive stations. By employing the improved blocking shield at selected stations, the film in the aggregate may have the desired thickness contour.

Sputter system incorporating an improved blocking shield for contouring

A system for the automated handling and transfer of wafers individually and repetitively to and between processing stations and cassettes. A track-like conveyor engages a cassette holding a plurality of wafers in vertically facing alignment, to move same horizontally past a loading station of a processing chamber. A vertically moveable blade passes between the conveyor tracks and through the cassette to engage a wafer edgewise from below and move same upwardly to the processing chamber entrance. Vacuum means mounted to the door of the chamber entrance engages and holds the wafer during insertion into the chamber by closure of the door. Clip means are mounted within the periphery of an aperture of a vertical support plate just within the chamber entrance, to engage edgewise the wafer and support it within the plate aperture while in the processing chamber. The wafer is removed after processing by operating the foregoing apparatus in reverse order. The processing chamber may be a vacuum chamber, and minimal-volume load lock means therefor are advantageously provided by the system with the aid of a sealing member within the chamber compressible against the wafer support plate and chamber wall while the chamber door is open, to seal off the entrance area from the remainder of the chamber. The wafer support plate is moveable within the processing chamber to various wafer processing stations once the door is closed and the sealing member withdrawn.

Growing community of inventors

Santa Clara, CA, United States of America

Martin A Hutchinson