Hewlett-packard Development Company, L.p.

Hewlett-packard Company

Other

Martha A Truninger

Charles Craig Haluzak

Daniel A Kearl

Colin C Davis

Timothy R Emery

Ronald L Enck

Michael G Monroe

Jeremy Harlan Donaldson

Roberto A Pugliese

Victor Joseph

Jeffrey Scott Obert

Steven David Leith

George Z Radominski

Ronnie Yenchik

Ravi Ramaswami

Alexander N Govyadinov

Douglas A Sexton

Donald L Michael

Donald J Milligan

Robert W Shreeve

John P Whitlock

Steve P Hanson

Diane Lai

J Daniel Smith

Phillip R Coffman

Chien-Hua Chen

Naoto A Kawamura

Silam J Choy

Tony S Cruz-Uribe

Sriram Ramamoorthi

Eric Lee Nikkel

Adel Jilani

Sadiq Bengali

Jeffery S Hess

Tim R Koch

Kenneth Michael Kramer

Chris Aschoff

William J Edwards

Norman L Johnson

Thomas H Ottenheimer

Harold Lee Van Nice

Steven R Geissler

In one embodiment, a fluid ejector structure includes: a chamber for containing a fluid; a flexible membrane forming one wall of the chamber; a plurality of piezoelectric elements; a backing operatively connected to the piezoelectric elements such that an expansion and/or contraction of a piezoelectric element causes the piezoelectric element to bend; a rigid plate overlaying a center portion of the membrane; a post coupling the piezoelectric elements to the plate through the backing such that a movement of each piezoelectric element toward the chamber is transmitted to the plate through the post. The plate is configured to transmit movement of the post to the membrane in a rigid, or substantially rigid, piston-like manner.

Fluid ejector structure

In one embodiment, a fluid ejector structure includes an orifice sub-structure and an ejector element sub-structure direct contact bonded together along a direct contact bonding interface. The orifice sub-structure has a plurality of orifices therein. Each orifice is positioned adjacent to a corresponding one of a plurality of fluid ejection elements on the ejector element sub-structure.

Fluid ejector structure and fabrication method

In one embodiment a method of making an electrostatic actuator includes: forming a first conductor over a first substrate to form a first structure; forming a flexible second conductor over a second substrate to form a second structure; forming an etch stop over the first conductor as part of the first structure or over the second conductor as part of the second structure; forming a spacer on the etch stop, the spacer selectively etchable with respect to the etch stop; etching the spacer through to the etch stop at a location of a gap between the first conductor and the second conductor; and bonding the first structure and the second structure together such that the first conductor is located opposite the second conductor across the gap.

Electrostatic actuator and fabrication method

One embodiment of a display system includes a first array that defines multiple reflective devices each movable between an inactive position to reflect light to a light dump and an active position to reflect light to an imaging region, a second array that defines multiple reflective devices each movable between an inactive position to reflect light to the light dump and an active position to reflect light to the imaging region, and an activation device that projects an activation beam to the devices to move individual ones of the devices between the active position and the inactive position, wherein the first array, the second array and the activation device are housed within a single vacuum enclosure.

Display system

A light modulator array includes a plurality of light modulator devices, each the light modulator device including a resistor, a conductor coupled to a first end of the resistor, a post coupled to a second end of the resistor, and a reflective plate supported by the post, an insulator separating a first of the modulator devices from an adjacent light modulator device, and an energy penetration reducer configured to prevent the insulator from becoming conductive in a region between a resistor of the first light modulator device and a conductor of the adjacent device.

Light modulator device

A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a standoff region and a localized bond region. The first and second substrate wafers and the underbump define a chamber that contains at least one microelectronic device.

Package having bond-sealed underbump

A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming a trench in the first side of the substrate, forming a mask layer within the trench, filling the trench with a fill material, forming a first portion of the opening in the substrate from the second side of the substrate toward the mask layer, and forming a second portion of the opening in the substrate through the mask layer and the fill material, including communicating the second portion of the opening with the first portion of the opening and the first side of the substrate.

Flextensional transducer and method of forming flextensional transducer

The described embodiments relate to a slotted substrate and methods of forming same. One exemplary method patterns a hardmask on a first substrate surface sufficient to expose a first area of the first surface and forms a slot portion in the substrate through less than an entirety of the first area of the first surface. The slot portion has a cross-sectional area at the first surface that is less than a cross-sectional area of the first area. After forming the slot portion, the method etches the substrate to remove material from within the first area to form a fluid-handling slot.

Slotted substrate and method of making

A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming a trench in the first side of the substrate, forming a mask layer within the trench, forming at least one hole in the mask layer, filling the trench and the at least one hole, forming a first portion of the opening in the substrate from the second side of the substrate to the mask layer, and forming a second portion of the opening in the substrate from the second side of the substrate through the at least one hole in the mask layer to the first side of the substrate.

Substrate and method of forming substrate for fluid ejection device

The described embodiments relate to a slotted substrate for use in a fluid ejecting device. One embodiment includes a substrate, and a slot received in the substrate. The slot has a central region and one or more terminal region(s). The central region extends at least in part along a pair of sidewalls. Individual terminal region(s) being defined by a terminal sidewall at least a portion of which extends away from both sidewalls of the central region.

A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming spaced stops in the first side of the substrate, partially forming a first portion of the opening in the substrate from the second side by a first process, further forming the first portion of the opening in the substrate from the second side by a second process, including forming the first portion of the opening to the spaced stops, and forming a second portion of the opening in the substrate from the first side, including forming the second portion of the opening between the spaced stops.

A process for fabricating a droplet plate for the printhead of an ink-jet printer, which process provides design flexibility, precise dimension control, as well as material robustness. Also provided is a droplet plate fabricated in accord with the process.

Droplet plate architecture

Growing community of inventors

Corvallis, OR, United States of America

Martha A Truninger