Other

Agilent Technologies, Inc.

Avago Technologies Fiber IP (singapore) Pte. Ltd

Avago Technologies Fiber IP Pte Ltd.

Martha A Johnson

Kendra J Gallup

Richard C Ruby

James A Matthews

Frank Sigming Geefay

Ronald Shane Fazzio

Carrie Ann Guthrie

Tanya Jegeris Snyder

A method for forming a lid for a wafer-scale package includes (1) forming a cavity in a substrate, (2) forming an oxide layer over the cavity and over a bond area around the cavity on the substrate, (3) forming a reflective layer over the oxide layer, (4) forming a barrier layer over the reflective layer, (5) etching a portion of the barrier layer down to a portion of the reflective layer over the bond area, and (6) forming a solder layer on the portion of the reflective layer. The reflective layer can be a titanium-platinum-gold metal stack and the barrier layer can be a titanium dioxide layer.

Lids for wafer-scale optoelectronic packages

In an embodiment, the invention provides a method for forming a wafer-level package. A bonding pad is formed on a first wafer. After forming the bonding pad, an optoelectronic device is located on the first wafer. A gasket is formed on a second wafer. After a gasket is formed on a second wafer, the second wafer is attached to the first wafer with a bond between the gasket and the bonding pad.

Wafer-level packaging of optoelectronic devices

A lid for a wafer-scale package includes a body having a bond area around a cavity defined by the body, an oxide layer atop the bond area and the cavity, and a reflective layer atop the oxide layer. The cavity has an angled sidewall where a portion of the reflective layer over the angled sidewall forms a mirror for reflecting a light. The lid further includes a solder layer atop another portion of the reflective layer over the bond area, and a barrier layer atop the mirror. The barrier layer is solder non-wettable so it prevents the solder layer from wicking into the cavity and interfering with the mirror. The barrier layer is also transparent to the light and has a thickness that either does not affect the light reflection or improves the light reflection.

A wafer-level package includes a first wafer comprising a bonding pad, an optoelectronic device on the first wafer, and a second wafer comprising a gasket. The second wafer is attached to the first wafer by a bond between the gasket and the bonding pad.

An air freshener holding device for evenly dispensing a fragrance throughout an entire room each time a fan unit is turned on. The air freshener holding device includes a container having a front wall, a back wall, a bottom wall, side walls, an open top, and a storage compartment being disposed therein and being adapted to removably retain cakes of deodorant; and also includes fastening members being attached to the container and being adapted to attach the container to a fan vent cover.

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Ridge Spring, SC, United States of America

Martha A Johnson