Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Marten Oldsen

Ulrich Hofmann

Wolfgang Reinert

Peter Merz

Hans Joachim Quenzer

Hans-Joachim Quenzer

Bernd Wagner

Oliver Schwarzelbach

The present application relates to a multiple component which is to be subsequently individualized by forming components containing active structures, in addition to a corresponding component which can be used in microsystem technology systems. The multiple component and/or component comprises a flat substrate and also a flat cap structure which are bound to each other such that they surround at least one first and one second cavity per component, which are sealed against each other and towards the outside. The first of the two cavities is provided with getter material and due to the getter material has a different internal pressure and/or a different gas composition than the second cavity. The present application also relates to a method for producing the type of component and/or components for which gas mixtures of various types of gas have a different absorption ratio in relation to the getter material.

Micromechanical housing comprising at least two cavities having different internal pressure and/or different gas compositions and method for the production thereof

The invention relates to a microsystem having at least one micromirror () and at least one micromirror actuator () for pivoting the at least one micromirror () about at least one axis from a relaxed resting position, comprising a frame chip and a transparent cover () disposed on the frame chip, wherein the frame chip has a chip frame (), on which the at least one micromirror () is articulated in an elastically pivoting manner, wherein the at least one micromirror () is further disposed within the chip frame () and in a cavity () that is formed between the transparent cover () and a carrier layer. To this end, the at least one micromirror () is articulated on a frame () pivotally about the at least one axis, the frame () in turn being pivotally articulated on the chip frame (), wherein the frame () is permanently pivoted out of a chip plane defined by the carrier layer such that the micromirror () in the resting position thereof is tilted about a non-pivoting angle relative to the chip plane. The invention further relates to a method for the production of such a microsystem.

Microsystem and method for the production of a microsystem

The cover according to the invention serves to encapsulate microsystems, wherein the cover comprises or is made of one or more cover units, and at least one cover unit comprises at least one first recess caused by deformation and bounded at least partially by at least one optical window, the quadratic surface roughness thereof being less than or equal to 25 nm. The invention further relates to a method for producing optical components, wherein the method is particularly also suitable for producing a cover according to the invention allowing encapsulation at the wafer level.

Cover for microsystems and method for producing a cover

The invention relates to a micromechanical actuator, especially a micro-mirror scanner, comprising an actuator unit in an outer frame which unit is suspended in the outer frame via two torsion elements, and electrostatic tilt drives from intermeshing first and second comb-type electrodes which are off-set from each other vertically. The first electrodes are rigidly connected to the outer frame and the second electrodes to the outer frame via an outer connecting element and to the actuator unit via an inner connecting element. The inner connecting element has a spring which extends in parallel to the outer tilting axis, which is connected to the same in a section of the actuator unit close the outer tilting axis, and which is designed and arranged to be rigid in the vertical direction and flexible at a right angle to the vertical direction. The micromechanical actuator according to the invention allows the use in a micro-mirror scanner whose slow axis is non-resonantly driven with excursions of &#x3e;+/&#x2212;7&#xb0;, lateral mirror sizes having dimensions of 1 mm and more and a resonant frequency of &#x3e;1 kHz and can be integrated even into flat mobile phones.

Electrostatic comb-drive micromechanical actuator

The present invention relates to a housing for one or more micromechanical and/or micro-optic components, wherein the housing exhibits a supporting substrate having at least one micromechanical and/or micro-optic component and at least one cap substrate, which is joined to the supporting substrate. The supporting substrate and the at least one cap substrate form at least one cavity, which at least partially encloses the at least one micromechanical and/or micro-optic component, wherein the side of at least one cap substrate facing the at least one micromechanical and/or micro-optic component exhibits at least one optical window and at least one mechanical stop. Furthermore, the object of the present invention is a method for producing such a housing, wherein the method is particularly usable for encapsulation at the wafer level.

Housing for micro-mechanical and micro-optical components used in mobile applications

The present invention relates to a method for producing a micro-mirror actuator and the corresponding actuator. In the method, the actuator is generated from a layered construction made of at least three main layers (), which are at least sectionally electrically insulated from one another via intermediate layers (). The layers are structured to form the micro-mirror element and the electrodes, the structuring being performed in such a way that a closed frame () is formed from at least the uppermost layer () around the inner area of the actuator, which allows a hermetic encapsulation of the inner area by application of a cover plate onto the frame. Furthermore, a conductor level (), which is electrically insulated from these layers via the intermediate layers, is generated between at least two of the layers and structured to form conductor paths, via which one or more electrodes may be electrically contacted from outside the frame () after the formation of contact openings in one or more of the intermediate layers (). A hermetically sealed encapsulation of the inner area of actuator may already be achieved easily at the wafer level using the method.

Micro-mirror actuator having encapsulation capability and method for the production thereof

The invention relates to a cover wafer with a core and with an inside, whereby the inside has one or more annular outer areas, (an) annular area(s), which inwardly adjoin(s) the outer area(s), and has (a) inner area(s), and to a component cover with only one annular outer area on its inside. The invention is characterized in that at least area(s) has/have a buffer layer, which has a wetting angle of &#x3c;35&#xb0; for a metallic eutectic solution that melts in a range of &#x3e;265&#xb0; C. to 450&#xb0; C. The invention also relates to a component cover having one of the areas which has said buffer layer in a comparable manner. The invention additionally relates to a wafer component or to a component, which can be inserted using microsystem technology and which has a cover wafer or component cover applied with the aid of a solder material, and to a method for the production thereof.

Solder material lining a cover wafer attached to wafer substrate

A method of creating a predefined internal pressure within a cavity of a semiconductor device, the method including providing the semiconductor device, the semiconductor device including a semiconductor oxide area which is continuously arranged between the cavity of the semiconductor device and an external surface of the semiconductor device, exposing the semiconductor device to an ambient atmosphere with a noble gas at a first temperature for a predetermined time period, and setting a second temperature, which is different from the first, after the predetermined time period has expired, the semiconductor oxide area exhibiting a higher permeability for the noble gas at the first temperature than at the second temperature.

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Hamburg, Germany

Marten Oldsen