Intel Corporation

Marni Nabors

Mark T Bohr

Mauro J Kobrinsky

Tahir Ghani

Rishabh Mehandru

Yih Wang

Ranjith Kumar

Sukru Yemenicioglu

Charles Henry Wallace

Leonard P Guler

Ruth Amy Brain

Mohit K Haran

Allen B Gardiner

Sourav Chakravarty

Quan Shi

Xinning Wang

Srinivasa Chaitanya Gadigatla

Tai-Hsuan Wu

Quan Phan

Nikolay Ryzhenko

Sivakumar Venkataraman

Mark Phillips

Devices, systems, and methods are described related to providing nonlinear lithographic seams, such as rectilinear lithographic seams, between adjacent fields of an integrated circuit die. Such nonlinear lithographic seams include lithographic enabling structures formed in co-planar layers with respect to functional structures in functional units of the fields of the integrated circuit die. Providing nonlinear lithographic seams improves layout efficiency of the functional units of the integrated circuit die.

Rectilinear seams between adjacent fields of a die for improved layout efficiency

Integrated circuit structures having backside gate tie-down are described. In an example, a structure includes a first vertical stack of horizontal nanowires over a first sub-fin, and a second vertical stack of horizontal nanowires over a second sub-fin, the second vertical stack of horizontal nanowires spaced apart from and parallel with the first vertical stack of horizontal nanowires. A gate structure includes a first gate structure portion over the first vertical stack of horizontal nanowires, wherein the first gate structure extends along an entirety of the first sub-fin. A second gate structure portion is over the second vertical stack of horizontal nanowires, wherein the second gate structure does not extend along an entirety of the second sub-fin. A gate cut is between the first gate structure portion and the second gate structure portion.

Integrated circuit structures having backside gate tie-down

Described herein are apparatuses, methods, and systems associated with a deep trench via in a three-dimensional (3D) integrated circuit (IC). The 3D IC may include a logic layer having an array of logic transistors. The 3D IC may further include one or more front-side interconnects on a front side of the 3D IC and one or more back-side interconnects on a back side of the 3D IC. The deep trench may be in the logic layer to conductively couple a front-side interconnect to a back-side interconnect. The deep trench via may be formed in a diffusion region or gate region of a dummy transistor in the logic layer. Other embodiments may be described and claimed.

Deep trench via for three-dimensional integrated circuit

Integrated circuit structures having front side signal lines and backside power delivery are described. In an example, an integrated circuit structure includes a plurality of gate lines extending over a plurality of semiconductor nanowire stack or fin channel structures within a cell boundary. A plurality of trench contacts is extending over a plurality of source or drain structures within the cell boundary, individual ones of the plurality of trench contacts alternating with individual ones of the plurality of gate lines. A first signal line, a second signal line, a third signal line, and a fourth signal line are over the plurality of gate lines and the plurality of trench contacts within the cell boundary. A backside power delivery line is coupled to one of the plurality of trench contacts within the cell boundary.

Integrated circuit structure with front side signal lines and backside power delivery

Described herein are integrated circuit (IC) structures, devices, and methods associated with device layer interconnects. For example, an IC die may include a device layer including a transistor array along a semiconductor fin, and a device layer interconnect in the transistor array, wherein the device layer interconnect is in electrical contact with multiple different source/drain regions of the transistor array.

Device layer interconnects

An integrated circuit structure includes a cell on a metal level, the cell defined by a cell boundary. A plurality of substantially parallel interconnect lines are inside the cell boundary. A first power track and a second power track are both dedicated to power and are located completely inside the cell boundary without any power tracks along the cell boundary on the metal level.

Standard cell architecture with power tracks completely inside a cell

An integrated circuit structure includes a metal level comprising a plurality of interconnect lines along a first direction. A cell is on the metal level, wherein one or more of the plurality of interconnect lines that extend through the cell comprise a power shared track that is segmented inside the cell into one or more power segments and one or more signal segments so that both power and signals share a same track.

Power shared cell architecture

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Portland, OR, United States of America

Marni Nabors