Sun Microsystems, Inc.

Oracle America, Inc.

Marlin R Vogel

Shlomo D Novotny

Arthur S Rousmaniere

David W Copeland

Andrew Richard Masto

John Dunn

Vadim Gektin

David G Love

Mike C Loo

Mario J Lee

A tandem fan system with an airflow-straightening heat exchanger removes heat from an airflow while providing optimal airflow pressure. The tandem fan system includes a first fan assembly and a second fan assembly, wherein each fan assembly has an inlet face and an outlet face, and includes at least one fan configured to propel a flow of air from the inlet face to the outlet face. The tandem fan system also includes a heat exchanger coupled between the first and second fan assemblies, wherein the heat exchanger includes at least one fin array and one or more heat pipes. The fin array and heat pipe combination is configured to draw heat from a flow of air that flows through the heat exchanger, and to straighten the flow of air so that the flow is perpendicular to the inlet face of the second fan assembly.

Tandem fan assembly with airflow-straightening heat exchanger

A cooling system for a rack-mount server includes a fan disposed within the rack-mount server and configured to produce an airflow through the rack-mount server, and a heat exchanger disposed within the rack-mount server in a path of the airflow through the rack-mount server. The heat exchanger includes a liquid circulation path structure and an airflow path structure. The airflow path structure is configured to shield electromagnetic interference.

Liquid-cooled rack with pre-cooler and post-cooler heat exchangers used for EMI shielding

A cooling system for a rack-mount server including at least one blade and a system enclosure includes a liquid cooling line, at least one heat exchanger connected to the liquid cooling line and including a plurality of fins divided into one or more sections of the plurality of fins, wherein the fin density of the plurality of fins varies over the one or more sections, and a plurality of fans configured to blow air through the at least one heat exchanger and cool the at least one blade in the rack-mount server.

Liquid-cooled rack with optimized rack heat exchanger design for non-uniform power dissipation

A method and system of deflecting air circulated in a data center room are disclosed. A method for controlling air circulation within a room having an aisle between racks with computer systems mounted thereon comprises supplying cooling air to computer systems in the racks via holes in a floor of the room and using a deflector to reduce flow of cooling air along the aisle toward an air intake of a cooling unit without passing the computer systems.

Data center room cold aisle deflector

A system and method for cooling electronic components. The system includes a surface. One or more electronic components are coupled to the surface, the one or more electronic components including an integrated circuit in contact with a heat sink. A blower is coupled to the surface, the blower having a first port, a second port, and an impeller that rotates around an axis. The blower is oriented such that the axis is perpendicular to the surface and non-intersecting with the heat sink, wherein the blower moves air across the heat sink.

Method and system for cooling electronic components

A cooling system is presented. The system includes a cooling circuit and at least one electronic component coupled to a surface. One or more heat dissipation structures are in thermal contact with the at least one electronic component. At least one sliding seal mechanism is coupled to the cooling circuit and the one or more heat dissipation structures so as to provide fluid communication between the cooling circuit and the one or more heat dissipation structures. The cooling circuit may include a tank that has a volumetric center and that is capable of holding a maximum volume of fluid. Fluid enters the tank through a tank input and exits the tank through a tank output. The tank output has a port through which fluid from the tank enters the tank output. The tank is capable of being filled with a fluid volume that is less than the maximum volume of fluid, such that the port remains immersed in fluid irrespective of tank orientation.

High-power multi-device liquid cooling

A device for the transfer of heat away from a heat source comprising a base having first and second surfaces a plurality of fins extending adjacent to the second surface of the base. The base further including a chamber disposed between the first surface and the second surface of the base. The chamber further including a divider disposed therein adjacent the first surface. A pump is also disposed within the chamber to circulate fluid within the chamber.

Heatsink with active liquid base

A water-cooled system and method for cooling electronic components. The system includes a surface. At least one electronic component is coupled to the surface, the at least one electronic component including an integrated circuit. A closed-loop fluidic circuit is coupled to the surface for removing heat from the integrated circuit. The closed-loop fluidic circuit includes a heat exchanger. A blower is coupled to the surface, the blower having a first port, a second port, and an impeller that rotates around an axis. The blower is oriented such that the axis is perpendicular to the surface and non-intersecting with the heat exchanger, wherein the blower moves air through the heat exchanger.

Water-cooled system and method for cooling electronic components

An apparatus and method for actively reducing the temperature gradient of a substrate. The substrate is placed in thermal contact with a heat dissipation structure so as to dissipate heat from the substrate. Current is passed through a thermoelectric device, so as to provide cooling to at least one hot spot on the substrate.

Active temperature gradient reducer

An integrated circuit device including an integrated circuit die having at least a first and a second heat-generating components formed thereon, and a heat dissipation structure thermally coupled to the die to dissipate heat generated by the components. The heat dissipating characteristics of the heat dissipation structure are tailored to match the heat generated by each of the first and second components.

Integrated circuit component temperature gradient reducer

A system and method of using refrigerant for cooling electronic components is presented. The system includes a surface. At least one electronic component is coupled to the surface, the at least one electronic component including an integrated circuit. A closed-loop refrigeration circuit is coupled to the surface for removing heat generated by the integrated circuit. The closed-loop refrigeration circuit includes a condenser. A blower is coupled to the surface, the blower having a first port, a second port, and an impeller that rotates around an axis. The blower is oriented such that the axis is perpendicular to the surface and non-intersecting with the condenser, wherein the blower moves air across the condenser.

Refrigerant-cooled system and method for cooling electronic components

An integrated circuit device package is integrated with a heat dissipation member to reduce the number of junctions in a packaged integrated circuit device. For example, the integrated circuit device package may include a substrate and a thermally conductive lid coupled to a first surface of the substrate, forming a closed cavity which encloses an integrated circuit die. The thermally conductive lid may be integrated with the heat dissipation member.

Integrated circuit device package and heat dissipation device

A liquid cooling module for semiconductor chips is disclosed. The module includes a plurality of substrates, each containing at least one chip. The substrates are arranged in the module so that when coolant flows through the module, the coolant is exposed to the top and bottom surfaces of the chips. A gasket is used between each substrate. The gasket is made if a Z-axis elastromeric material that is impervious to liquid and therefore directs the flow of the coolant in the module and makes the module liquid tight. The material also is conductive in the Z direction, but not the X or Y direction, thereby making electrical communication between the chips on different substrate levels possible. The module is intended to be attached to a circuit board, thus simplifying the layout of liquid cooled chips on the board.

Growing community of inventors

Fremont, CA, United States of America

Marlin R Vogel