Trumpf Werkzeugmaschinen Gmbh + Co. Kg

Trumpf Laser- Und Systemtechnik Gmbh

Markus Zimmermann

Korbinian Weiss

Tobias Hagenlocher

Dieter Hallasch

Markus Blaschka

Wolf Wadehn

A method for determining a reference focal position of a laser beam for processing a plate-like member, the method comprising producing at least two incisions in the plate-like member with the laser beam set at different focal positions, irradiating the plate-like member with the laser beam, detecting edges of the incisions by measuring one or more parameters relating to the irradiation of the plate-like member, and establishing a width of the at least two incisions using the detected one or more parameters.

Method for determining the reference focal position of a laser beam

This disclosure relates to methods and apparatuses for marking a data matrix code in the form of an n*m cell matrix of light and dark cells, which respectively consist of a light or dark s*t pixel matrix, on a workpiece by a laser beam, wherein a laser processing unit directs the laser beam onto the workpiece, scans, pixel row by pixel row, the workpiece region to be marked, respectively with a constant marking speed and alternately in opposite directions, and wherein the light pixels and/or the dark pixels are marked on the workpiece during the scan by temporarily switching on the laser beam, wherein the laser processing unit is guided from an already scanned pixel row along a curve having a diameter of which is at least two times the pixel row spacing, to the next pixel row to be scanned.

Marking a workpiece with a data matrix code by means of a laser beam

A method for monitoring cutting processing on a workpiece whereby a part of the workpiece is separated from a remainder of the workpiece along a desired cut contour, wherein, after the cutting processing, the following steps are carried out: irradiating the workpiece with a laser beam at a location within the desired cut contour, detecting radiation generated by an interaction between the laser beam and the workpiece, and evaluating the detected radiation to determine whether, during the cutting processing, the part of the workpiece was completely separated from the remainder of the workpiece. The invention also relates to a laser processing machine for carrying out the method.

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Leinfelden-Echterdingen, Germany

Markus Zimmermann