Osram Opto Semiconductors Gmbh

Osram Opto Semiconductor Gmbh

Mars, Incorporated

Osram Gesellschaft MIT Beschrankter Haftung

Mei, Inc.

Markus Zeiler

Mario Wanninger

Hubert Ott

Herbert Brunner

Thomas Höfer

Günter Waitl

Simon Blümel

Frank Möllmer

Ludwig Plötz

Guenter Kirchberger

Ludwig Ploetz

Rainer Sewald

Josef Huettner

Peter Wolff

Georg Bogner

Stefan Grötsch

Julius Muschaweck

Robert Kraus

Gertrud Kräuter

Harald Stoyan

Edward M Zoladz, Jr

Michael Sailer

Matthias Winter

Günter Kirchberger

Felix Michel

Kurt-Jürgen Lang

Christian Ferstl

Ulrich Steegmueller

An illumination device includes a number of radiation reflectors that are each irradiated by at least one light source. The radiation reflectors are shaped in such a way that they can be combined modularly to form a radiation-reflecting luminous area.

Illumination device with radiation reflectors arranged modularly to form a radiation-reflecting luminous area

An optoelectronic component () is proposed that comprises a housing body () and at least one semiconductor chip () disposed thereon, said housing body having a base part () comprising a connector body (), on which a connecting conductor material () is disposed, and said housing body having a reflector part () comprising a reflector body (), on which a reflector material () is disposed, wherein said connector body and said reflector body are preformed separately from each other and said reflector body is disposed on said connector body in the form of a reflector top.

Optoelectronic component with multi-part housing body

An illumination device comprises at least one light module () wherein the light module () comprises a circuit board () to which a plurality of groups () of light sources (,,) are applied and a carrier () on which the light module () is fixed. A display apparatus comprising such an illumination device is also disclosed.

Illumination device

A lighting arrangement comprises an optical apparatus () with a radiation outlet surface () and an optoelectronic component () for producing radiation, with an element () which is formed like a reflector being formed. The shape and arrangement of the element are suitable for deflecting radiation generated in the component through the radiation outlet surface, and the element is designed to specifically absorb this radiation. The lighting arrangement is preferably intended for particularly homogeneous back-lighting of display apparatuses such as liquid crystal displays (LCDs).

Lighting assembly

An LED module includes a carrier and a number of light sources. Each light source is arranged on the carrier in such a way that the LED module comprises a radiation uniformity which is less than the statistical mean of a radiation uniformity distribution, wherein the radiation uniformity distribution is based on a plurality of LED modules with a random arrangement of the light sources.

LED module

A lighting apparatus comprising a plurality of light modules is specified, wherein each light module includes a plurality of groups of light sources mounted on a circuit board of said light module, and said light modules are arranged in rows on a carrier of said lighting apparatus. A display device comprising such a lighting apparatus is also specified.

Disclosed is an illumination device comprising a radiation-emitting front side and a multiplicity of light sources (R, G, B), wherein said multiplicity of light sources (R, G, B) is divided into light source groups (LG) and the light source groups (LG) are arranged on the grid points of a first regular grid.

A method for patterned metallization of a plastic-containing body, which comprises the steps of producing the body via a two-component injection-molding process with at least two plastics, one of which is non-metallizable, and metallizing the body in such a way that a metallized region and a non-metallized region are formed, wherein the non-metallized region is determined by the non-metallizable plastic. A method for the patterned metallization of a plastic-containing body in particular a package body for an optoelectronic device is also provided.

Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body

A method for producing a laser diode component having an electrically insulating housing basic body and electrical connecting conductors, which are led out from the housing basic body and are accessible from outside the housing basic body. The housing basic body is produced from a material which is transmissive to a laser radiation emitted by the laser diode component. The housing basic body includes a chip mounting region. A beam axis of the laser diode component runs through the housing basic body. A housing that can be produced in this way and laser diode component having a housing of this type are also disclosed.

Method for producing a laser diode component, housing for a laser diode component, and laser diode component itself

An optoelectronic device, comprising a package body () and at least one semiconductor chip () arranged on the package body (). The surface of the package body () has a metallized subregion () and a non-metallized subregion (). The package body () includes at least two different plastics (), one of the plastics being non-metallizable () and this plastic determining the non-metallized subregion (). A method for producing such components and a method for the patterned metallization of a plastic-containing body are also provided.

Optoelectronic device with patterned-metallized package body, method for producing such a device and method for the patterned metallization of a plastic-containing body

A subassembly for a document validator. In an implementation, the subassembly includes a housing, a light pipe core seated in the housing, a light control layer and at least one light source. The apparatus may also include a prism structure layer between a top diffusing surface and the light control structure. The housing may also include at least one input light port on at least one end of the light pipe core.

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Nittendorf, Germany

Markus Zeiler