Atotech Deutschland Gmbh

Atotech Deutschland Gmbh & Co. Kg

Markus Youkhanis

Bert Reents

Bernd Roelfs

Soungsoo Kim

Thomas Pliet

Toshiya Fujiwara

Rene Wenzel

Sven Lamprecht

Kai-Jens Matejat

Horst Brüggmann

Akif Özkök

Marko Mirkovic

Tafadzwa Magaya

Mustafa Özkök

René Wenzel

The present invention refers to a method of preparing a high density interconnect printed circuit board (HDI PCB) including microvias filled with copper comprising the steps of:

Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit board

The present invention relates to a galvanic process for filling through-holes with metals. The process is particularly suitable for filling through-holes of printed circuit boards with copper.

Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper

The present invention relates to a galvanic process for filling through-holes with metals. The process is particularly suitable for filling through-holes of printed circuit boards with copper. The process comprises the following steps: (i) formation of a narrow part in the center of a through-hole by electroplating; and (ii) filling the through-hole obtained in step (i) with metal by electroplating.

Disclosed is an electroplating method for filling cavities, through holes, blind holes, or micro blind holes of a work piece with metals. According to said method, the work piece containing cavities, through holes, blind holes, or micro blind holes is brought in contact with a metal deposition electrolyte, and a voltage is applied between the work piece and at least one anode such that a current flow is fed to the work piece. The invention method is characterized in that the electrolyte encompasses a redox system.

Electrolytic method for filling holes and cavities with metals

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Berlin, Germany

Markus Youkhanis