Endress + Hauser Flowtec Ag

Markus Wucher

Matthias Brudermann

Daniel Kollmer

Christoph Werle

Thomas Böhler

Ludovic Adam

Alexander Stutz

Jannis Kappertz

A PAM transceiver configured to process an electrical data signal having at least three states includes an electronic circuit comprising: a data interface configured to connect to a duplex communication channel; a first circuit section connected to the data interface; and a second circuit section connected to the data interface. The first circuit section includes an equalizer for compensating for distortions in the data signal and an interpreter downstream of the equalizer for recognizing symbols. The second circuit section includes a delay unit for time-shifting the data signal and an MMA processor for recognizing a signal phase of the data signal. The first circuit section and the second circuit sections are routed to the MMA processor. The second circuit section has a finite impulse response filter configured to monotonize an impulse response of the communication channel.

Pulse-amplitude modulation transceiver, field device and method for operating the pulse-amplitude modulation transceiver

A method for determining an inverse impulse response of a communication channel by means of a PAM receiver comprises the following method steps: switching on the PAM receiver; if a second PAM transceiver is switched on, setting a difference between a clock frequency of the data signal and a sampling frequency of the first PAM transceiver; comparing a symbol that is output by the interpreter with a state that is supplied to the interpreter, and outputting an error value, wherein in each case a symbol associated with a sampling clock is compared with a state associated with the same sampling clock; adapting m filter coefficients of the equalizer to minimize error values; repeating the third method step and the fourth method step until an error limit value is reached.

Method for determining an inverse impulse response of a communication channel

A circuit board comprising a contacting arrangement, including three metal contacting regions, which are connected with one or more data links of the circuit board and in the case of contact with a communication interface of a test system enable a data exchange with a data memory of a circuit board.

Printed circuit board with contacting arrangement

A test system for checking electrical connections, especially solder connections, between electronic components with a circuit board to be checked, characterized in that the test system includes a communication interface with at least three electrically-conductive contact tips, which by contact with a contacting arrangement on the circuit board having a number of contacting locations enable a data exchange with a data memory and/or a communication module of a circuit board, wherein the data exchange occurs according to a communication protocol.

Test system for checking electronic connections of components with a printed circuit board and printed circuit board

A test system for testing electric connections, in particular soldered connections, between electronic components and a printed circuit board to be tested, characterized in that the test system includes a subassembly, which is movably mounted in a housing of the test system, and a current and/or voltage source for energizing the circuit board to be tested, the current and/or voltage source being arranged in the housing of the test system in such a way as to be movable in at least two directions in space.

Test system for checking electrical connections of electronic components to a printed circuit board

A test system for testing electrical connections, especially soldered connections, between electronic components and a circuit board to be tested, characterized in that the test system has a communication interface, which by contacting the circuit board enables a data exchange with a data memory or a communication module of the circuit board to be tested, wherein the communication interface is arranged within a housing of the test system freely movably in at least two spatial directions, preferably three spatial directions.

Test system for testing electrical connections between components and a printed circuit board

Disclosed is a test system for testing electric connections, in particular soldered connections, between electronic components and a printed circuit board to be tested, characterized in that the test system includes a subassembly, which is movably mounted in a housing of the test system, and a current and/or voltage source for energizing the circuit board to be tested, the current and/or voltage source being arranged in the housing of the test system in such a way as to be movable in at least two directions in space.

Growing community of inventors

Lörrach, Germany

Markus Wucher