Ev Group E. Thallner Gmbh

Ev Group Gmbh

Markus Wimplinger

Thomas Wagenleitner

Friedrich Paul Lindner

Thomas Plach

Florian Kurz

Viorel Dragoi

Michael Kast

Kurt Hingerl

Bernhard Rebhan

Alexander Filbert

Thomas Glinsner

Christoph Flotgen

Christoph Flötgen

Jürgen Burggraf

Harald Wiesbauer

Erich Thallner

Jurgen Burggraf

Gerald Kreindl

Gerald Mittendorfer

Klaus Martinschitz

Alfred Sigl

Mustapha Chouiki

Jacek Gasiorowski

Paul Lindner

Christoph FLÖTGEN

Friedrich Paul Linder

A method for measuring a multilayered substrate, particularly with at least one structure with critical dimensions, the method including the steps of (a) producing the substrate with a plurality of layers, particularly with a structure, wherein the dimensions of the layers and in particular the structures are known, (b) measuring the substrate using at least one measuring technology, (c) creating a simulation of the substrate using the measurement results from the measurement of the substrate, (d) comparing the measurement results with simulation results from the simulation of the substrate, and (e) optimizing the simulation and renewed creation of a simulation of the substrate using the measurement results from the measurement of the substrate, in the event that there is a deviation of the measurement results from the simulation results, or (e) calculating parameters of further substrates, in the event that the measurement results correspond to the simulation results.

Device and method for measuring a substrate

A method for bonding chips onto a substrate or onto further chips. The chips are bonded onto the substrate or the further chips by means of a direct bond.

Method for bonding of chips

A stamp comprised of a soft stamp and a carrier fixed to the soft stamp.

Stamp and method for embossing

A process for the production of a permanent, electrically conductive connection between a first metal surface of a first substrate and a second metal surface of a second substrate, wherein a permanent, electrically conductive connection is produced, at least primarily, by substitution diffusion between metal ions and/or metal atoms of the two metal surfaces.

Method for permanent connection of two metal surfaces

A method and device for bonding chips onto a substrate or onto further chips. The chips are bonded onto the substrate or the further chips by means of a direct bond using a bond head having a first surface configured to couple to a chip that is to be bonded, and a second surface fixed to and disposed opposite the first surface. A first spring element having a first spring constant and a second spring element having a second spring constant are coupled to the second surface, where the first spring constant is different from the second spring constant.

Device for bonding chips

A device, a system and a method for bonding two substrates. A first substrate holder has a recess and an elevation.

Device and method for bonding of two substrates

A method for surface treatment of an at least primarily crystalline substrate surface of a substrate such that by amorphization of the substrate surface, an amorphous layer is formed at the substrate surface with a thickness d&#x3e;0 nm of the amorphous layer. This invention also relates to a corresponding device for surface treatment of substrates.

Method and device for surface treatment of substrates

A method and device for bonding chips onto a substrate or onto further chips. The chips are bonded onto the substrate or the further chips by means of a direct bond.

Method and device for bonding of chips

A receiving means for receiving and mounting of wafers, comprised of a mounting surface, mounting means for mounting a wafer onto the mounting surface and compensation means for active, locally controllable, compensation of local and/or global distortions of the wafer.

Accommodating device for retaining wafers

A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

Growing community of inventors

Ried im Innkreis, Austria

Markus Wimplinger