Qualcomm Incorporated

Qualcomm Technologies, Inc.

Rf360 Europe Gmbh

Markus Valtere

José Moreira

Jeroen Bielen

Alberto Jose Teixeira De Queiros

Bart Kassteen

Juergen Portmann

Disclosed are apparatuses and methods for fabricating the apparatuses. In one aspect, an apparatus includes a high-power die mounted on a backside of a package substrate. A heat transfer layer is disposed on the backside of the high-power die. A plurality of heat sink interconnects is coupled to the heat transfer layer. The plurality of heat sink interconnects is located adjacent the high-power die in a horizontal direction.

High-power die heat sink

Disclosed are apparatuses and methods for fabricating the apparatuses. In one aspect, an apparatus includes a high-power die mounted on a backside of a package substrate. A heat transfer layer is disposed on the backside of the high-power die. A plurality of heat sink interconnects is coupled to the heat transfer layer, where each of the plurality of heat sink interconnects is directly coupled to the heat transfer layer in a vertical orientation.

High-power die heat sink with vertical heat path

Growing community of inventors

Bavaria, Germany

Markus Valtere