Robert Boschgmbh

Markus Ulm

Matthias Metz

Brian H Stark

Gary Yama

Zhiyu Pan

Roland Mueller-Fiedler

Thomas Eh Walter

Franz Laermer

Christoph Lang

Silvia Kronmueller

Tino Fuchs

Mathias Reimann

Markus Lutz

Aaron Partridge

Po-Jui Chen

Wilhelm Frey

Ando Feyh

Dirk Steinbuch

Thomas Buck

Udo-Martin Gomez

Ando Lars Feyh

Florian Grabmaier

Lutz Mueller

Harald Emmerich

Klaus Breitschwerdt

Kersten Kehr

Andrea Urban

Klaus Offterdinger

Joerg Schoebel

Thomas Klaus

Tristan Jobert

Emma Abel

Christian Gerhardt

Cyril Vancura

Stefan Keith

Michael Struchholz

Dirk Dittmann

A method of fabricating a semiconductor device comprises forming a dielectric layer above a substrate, the dielectric layer including a fixed dielectric portion and a proof mass portion, forming a source region and a drain region in the substrate, forming a gate electrode in the proof mass portion, and releasing the proof mass portion, such that the proof mass portion is movable with respect to the fixed dielectric portion and the gate electrode is movable with the proof mass portion relative to the source region and the drain region.

CMOS integrated moving-gate transducer with silicon as a functional layer

A semiconductor device includes a substrate, a first dielectric layer located above the substrate, a moving-gate transducer, and a proof mass. The moving-gate transducer is at least partially formed within the substrate and is at least partially formed within the first dielectric layer. The proof mass includes a portion of the first dielectric layer and a portion of a silicon layer. The silicon layer is located above the first dielectric layer.

A tri-axis accelerometer includes a proof mass, at least four anchor points arranged in at least two opposite pairs, a first pair of anchor points being arranged opposite one another along a first axis, a second pair of anchor points being arranged opposite one another along a second axis, the first axis and the second axis being perpendicular to one another, and at least four spring units to connect the proof mass to the at least four anchor points, the spring units each including a pair of identical springs, each spring including a sensing unit.

Tri-axis accelerometer having a single proof mass and fully differential output signals

A device for controlling a device by using a rotation-rate sensor. In order to provide a device for determining a triggering signal for a safety device which allows a particularly compact implementation of the device, the device is set up to ascertain an acceleration variable on the basis of a first sensor signal for a first seismic mass of the rotation-rate sensor and the second sensor signal for a second seismic mass of the rotation-rate sensor and to control the device as a function of the acceleration variable.

Method for controlling a device and a device for controlling the device

A sensor device includes a housing base part, a bearer part, a chip structure situated on the bearer part, and a spring/damper combination via which the housing base part and the bearer part are elastically connected to one another. In the sensor device, the housing base part, the spring/damper combination and the bearer part are situated one over the other.

Sensor device

Methods of making an energy harvesting device are described. A case and integrated piezoelectric cantilever to harvest vibration energy from an environment being sensed is produced via a print forming method injection molding method. The cantilever device consists of a piezoelectric material member, and a proof mass of high density material coupled to the piezoelectric member. The print forming method is used to build up the base and walls of the device as well as the neutral layers of the piezoelectric member. Metal layers are printed to form the electrode layers of the piezoelectric member and the electrical contact portions of the device. Passive components can also be formed as part of the layers of the device. The entire assembly can be encapsulated in plastic.

Method of producing a device

An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450 C is described. The coating is applied after device release but before sealing vents in the encapsulation layer. Alternatively, an anti-stiction coating may be applied to released devices directly before encapsulation.

Microelectromechanical systems encapsulation process

There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. An embodiment further includes location of a piezoelectric material as part of a semiconductor sensing structure. The semiconductor sensing structure, in conjunction with the piezoelectric material, can be used as a sensing device to provide an output signal associated with a sensed event.

Microelectromechanical devices and fabrication methods

A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure. An anti-stiction layer is disposed on at least a portion of the mechanical structure. An anti-stiction channel is formed in at least one of the substrate and the encapsulation structure. A cap has at least one preform portion disposed over or in at least a portion of the anti-stiction channel to seal the anti-stiction channel, at least in part.

Anti-stiction technique for electromechanical systems and electromechanical device employing same

An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450&#xb0; C. is described. The coating is applied after device release but before sealing vents in the encapsulation layer. Alternatively, an anti-stiction coating may be applied to released devices directly before encapsulation.

Microelectromechanical systems encapsulation process with anti-stiction coating

A component is provided for an impedance change in a coplanar waveguide which includes two grounding conductors and a signal line lying between the grounding conductors, as well as a conducting connecting element, which has a covering surface for the two grounding conductors and the signal line, and is electrically insulated, so that in each case a capacitor is formed. The connecting element and the lines are situated and arranged so that the respective capacitor between the grounding conductors and the connecting element has an invariable capacitance, but the capacitor between the connecting element and the signal line has a variable capacitance. A structure is also provided in which in an exactly opposite way, the respective capacitor between the grounding conductors and the connecting element has a variable capacitance, but the capacitor between the connecting element and the signal line has an invariable capacitance. Furthermore, a method for producing such a component is also provided.

Component for impedance change in a coplanar waveguide and method for producing a component

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Wannweil, Germany

Markus Ulm