Bystronic Laser Ag

Markus Steinlin

Titus Haas

Simon Scheidiger

Michael Berger

Andreas Luedi

Martin Mumenthaler

Sergio Bossoni

Wilfried Liegard

Thomas Rataj

A control unit for calculating a spatially and time-resolved, combined setpoint data set for control of a laser cutting process includes a measurement data interface for accessing sensor data during the cutting operation, a process interface to a first memory that stores a process model that estimates status data of the laser cutting process and a cutting result, a machine interface to a second memory in which a machine model is stored which represents a kinematic behaviour of the laser cutting head and estimates status data of a movement process and the cutting result thereof, and a processor that executes an algorithm that couples the process model and the machine model via a feed rate value and/or via a nozzle spacing value. The processor accesses the process model and the machine model in order to calculate the spatially and time-resolved, combined setpoint data set with coordinated setpoints.

Method, control unit and laser cutting system for combined path and laser process planning for highly dynamic real-time systems

In one aspect, the present invention relates to a control unit (RE) for calculating a spatially and time-resolved, combined setpoint data set (SW-DS) for open- and/or closed-loop control of a laser cutting process during laser cutting with a laser cutting machine (L), wherein a processor (P) is intended to access a process model (PM) in a first memory (SI) via a process interface (P-SS) and a machine model (MM) in a second memory (S2) via a machine interface (M-SS) in order, on the basis of an estimated status data of the laser cutting process and the movement process, to calculate the spatially and time-resolved, combined setpoint data set (SW-DS) with coordinated setpoints for the laser cutting process and setpoints for the movement process, taking into account the read-in sensor data.

Cutting a workpiece and producing workpiece parts are disclosed. The device has a cutting head with laser beam optics with a dynamic laser beam movement unit. A cutting head movement unit moves the laser beam over the workpiece. A control unit has a determination module to determine a movement trajectory of the laser beam, a memory unit from which at least one predetermined parameter selected from a movement parameter of the cutting head movement unit, a movement parameter of the laser beam movement unit and a parameter of a deviation of a cut contour from a predetermined contour is retrievable, and an optimization module for adjusting the movement trajectory by overlaying the movement of the laser beam via the cutting head with a high frequency beam-shaping movement of the laser beam via the laser beam movement unit based on the at least one predetermined parameter.

Device and method for laser cutting a workpiece and producing workpiece parts

The present disclosure relates to a fixing device arranged to be fastened to a machining head such as a drill head. A machine tool for machining workpieces such as metal sheets at a machining point is also disclosed. The workpieces may be machined from a machining side. A fastening device is included and adapted for fastening the fixing device to the machining head. A fixing head is included and adapted for releasably, locally fixing the workpiece on its machining side and adjacent to the machining point. A controller is included and configured to control the fixing and releasing of the fixing head on a workpiece.

Fixing device, machining head, machine tool and method for fixing a workpiece

According to the present application, a machining apparatus () for the laser machining of a workpiece () in a machining zone () is provided, having a first interface () for a machining laser source for generating a machining laser beam (), a second interface () for a detector device (for detecting radiation () emitted by the machining zone (); an outlet opening () for the machining laser beam (); and first and second laser beam guiding devices (), wherein the first laser beam guiding device (),) is arranged and designed such that it guides the machining laser beam () to the second laser beam guiding device () and dynamically moves the machining laser beam (), and the second laser beam guiding device () is arranged and designed such that it guides the dynamically moved machining laser beam () through the outlet opening () and at least partially guides the radiation () emitted by the machining zone () through the outlet opening to the second interface (). Further provided is a method for the laser machining of a workpiece ().

Machining apparatus for the laser machining of a workpiece and method of the laser machining of a workpiece

Beam processing machines such as laser beam or fluid jet processing machines () for processing workpieces () include a frame (), a workpiece rest () held by the frame (), and a beam tool () movable relative to the workpiece rest (). Incorporated in a vibration-transmitting connecting path between the beam tool and the rest surface for workpieces defined by the workpiece rest are a plurality of damping elements that decouple vibrations between the rest surface and beam tool, its mounting, or the frame.

Growing community of inventors

Zurich, Switzerland

Markus Steinlin