Siltronic Ag

Markus Schnappauf

Leszek Mistur

Manfred Thurner

Vladimir Dutschke

Torsten Olbrich

Gunther Kann

Karl-Heinz Wajand

Armin Deser

A method dresses one polishing cloth or two polishing pads simultaneously, in which a polishing cloth has been applied to a polishing plate, with at least one dresser (), which is equipped with at least one dressing element (), this at least one dressing element () being in contact with the at least one polishing cloth () to be dressed, wherein the at least one polishing plate () is rotated with a relative rotational speed and the at least one dresser () is rotated with a relative rotational speed and at least two different combinations of directions of rotation of the two pairs of polishing plates () and pin wheels () are executed during the simultaneous dressing of two polishing pads () or during the dressing of one polishing cloth () of the polishing plate () and of the at least one dresser ().

Method for dressing polishing pads

The invention relates to a process for producing a semiconductor wafer by simultaneous polishing of a front surface and a back surface of the semiconductor wafer with a polishing fluid between rotating polishing plates during a polishing run which lasts for a polishing time, the semiconductor wafer being located in a cutout in a carrier having a defined carrier thickness and being held on a defined geometric path, the semiconductor wafer having a starting thickness prior to polishing and a final thickness after polishing. The polishing time for the polishing run is calculated from data which include the starting thickness of the semiconductor wafer and the carrier thickness as well as the starting thickness and final thickness and the flatness of a semiconductor wafer which was polished during a polishing run preceding the present polishing run.

Process for producing a semiconductor wafer

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Zell am Moos, Austria

Markus Schnappauf