Siemens Aktiengesellschaft

Boehringer Ingelheim Vetmedica Gmbh

Markus Schieber

Harry Hedler

Jörg Zapf

Heinz Schoeder

Susanne Kornely

Daniel Sickert

Karl Weidner

Maximilian Fleischer

Florian Poprawa

Kerstin Wiesner

Oliver Freudenberg

Christina Schindler

Joerg Zapf

Ingo Kuehne

Manfred Schreiner

A chip and a method for producing the chip with a plurality of measurement regions which are provided with electrodes for electrically detecting reactions in which, in order to reliably separate the individual measurement regions from one another, a monolayer of a fluorosilane is formed on the chip surface which has strongly hydrophobic properties. Therefore, during spotting with a liquid, the drops of liquid applied by spotting can be reliably prevented from coalescing, and thus, causing mixing of the substances in the drops of liquid which are supposed to be immobilized in the measurement regions.

Method for producing a plurality of measurement regions on a chip, and chip with measurement regions

The invention relates to a circuit carrier (), comprising a digital circuit, which contains at least two components () that are electrically connected to each other (). Additionally, an electric shield () is provided. According to the invention, the electric shield () and a conducting path () for electrically connecting the components () are realized by means of a single layered composite (). In particular, the electric shield () and the conducting path () are formed by the same electrically conductive layer, wherein a hole () ensures complete electrical insulation of the conducting path () from the shield (). The invention further relates to a method for producing such a circuit carrier.

Circuit carrier having a conducting path and an electric shield

An infrared sensor with a microstructure has a multiplicity of sensor rods protruding from a sensor base and arranged axially parallel to one another. Each of the sensor rods is designed as a thermocouple, in that a first rod end, arranged on the sensor base, is electrically connected to an opposite free second rod end by both a first and a second electrically conductive rod element. The two rod elements have a different Seebeck coefficient, and the first rod element is formed as a hollow profile and the second rod element is arranged in the first rod element such that each thermocouple is formed as a single rod with a small standing area on the sensor base.

Infrared sensor, thermal imaging camera and method for producing a microstructure from thermoelectric sensor rods

A a chip and a method for producing the chip with a plurality of measurement regions which are provided with electrodes for electrically detecting reactions in which, in order to reliably separate the individual measurement regions from one another, a monolayer of a fluorosilane is formed on the chip surface which has strongly hydrophobic properties. Therefore, during spotting with a liquid, the drops of liquid applied by spotting can be reliably prevented from coalescing, and thus, causing mixing of the substances in the drops of liquid which are supposed to be immobilized in the measurement regions.

A microscreen, substantially formed of a photoresist material, is produced by applying a photoresist layer to a support using a liquid photoresist, partially covering the photoresist layer with a mask that defines the structure of the microscreen, exposing the photoresist to radiation, developing the photoresist, and removing the photoresist from the support.

Method for producing a microscreen

A method produces a microscreen by providing a support and applying a photoresist layer with a definable thickness to the support. The photoresist is exposed by radiation using a mask that defines the structure of the microscreen. The photoresist is then developed. The thickness of the photoresist layer is selected such that, in a sub-region of the photoresist layer, the radiation used for the exposure penetrates only so slightly that practically no cross-linking of the photoresist takes place.

At least two separate single-crystal silicon layers are formed in a micromechanical substrate which has a diaphragm in a partial region. The diaphragm has a thickness of less than 20 &#x3bc;m and includes part of a first of the single-crystal silicon layers. The substrate construction also includes a heating element configured to generate a temperature of more than 650&#xb0; C. in at least part of the diaphragm. The substrate includes at least one diffusion barrier layer that reduces the oxidation of the first single-crystal silicon layer.

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Munich, Germany

Markus Schieber