Ams Sensors Singapore Pte. Ltd.

Heptagon Micro Optics Pte. Ltd.

Heptagon Oy

Ams Sensors Asia Pte. Ltd.

Ams-osram Asia Pacific Pte. Ltd.

Markus Rossi

Hartmut Rudmann

Jens Geiger

Peter Roentgen

Stephan Heimgartner

Moshe Doron

Mario Cesana

Ville Kettunen

Simon Gubser

Dmitry Vasily Bakin

Bassam Hallal

Kai Engelhardt

Matthias Gloor

Ohad Meitav

Alireza Yasan

Alexander Bietsch

Peter Riel

Daniel Pérez Calero

Tobias Senn

Jukka Alasirniö

Bernhard Buettgen

Nicola Spring

Florin Cutu

Robert Lenart

Hans Peter Herzig

Martin Lukas Balimann

Julien Boucart

Michael Kiy

Philippe Bouchilloux

Hendrik Volkerink

Daniel Perez Calero

Mai-Lan Elodie Boytard

Ali Naqavi

Oliver Chidley

Daniel Dias

Andreas Maciossek

Chuni Lal Ghosh

Laurence Watkins

Susanne Westenhöfer

Jean-Francois Seurin

James Eilertsen

Jukka Alasirnio

Baiming Guo

Camilla Camarri

Matthias Maluck

Susanne Westenhofer

Diane Morgan

Kotaro Ishizaki

Philipp Mueller

Elisa Parola

Daniel Infante Gomez

Renè Kromhof

Dmitry Ryuma

Philipp Müller

Daniel Infante Gómez

Harmut Rudmann

Lijian Mai

Maryam Yousefi

Toralf Scharf

Laurent Nevou

Ferran Suarez

A device includes an illumination device for emitting an illumination beam. The illumination device includes an emitter array including multiple light emitters; and a micro-lens array (MLA) including multiple micro-lenses. The MLA is positioned to receive light emitted from the emitter array. Light from the MLA forms the illumination beam. A first region of the MLA is offset from the emitter array by a first offset amount, and a second region of the MLA is offset from the emitter array by a second offset amount different than the first offset amount.

Producing illumination beams using micro-lens arrays

An optical device includes a display and an optical sensor. The display includes display circuitry. The optical sensor is arranged behind the display. The optical sensor includes an emitter for emitting light through the display and a receiver for receiving light reflected back through the display. An absorption of the display is wavelength dependent and the absorption of the display is 50% at a first wavelength. The emitter is configured to emit light at a second wavelength greater than the first wavelength.

Behind display proximity sensing

The method for manufacturing optical light guide elements comprises providing a plurality of initial bars, each initial bar extending along a respective initial-bar direction from a first bar end to a second bar end and having a first side face extending from the first bar end to the second bar end, the first side face being reflective; positioning the initial bars in a row with their respective initial-bar directions aligned parallel to each other and with their respective first surfaces facing towards a neighboring one of the initial bars; and fixing the plurality of initial bars with respect to each other in the position to obtain a bar arrangement.

Manufacture of optical light guides

Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.

Compact opto-electronic modules and fabrication methods for such modules

An illumination apparatus () for producing structured light and flood illumination, the illumination apparatus comprising a microlens array () comprising microlenses which are arranged at a pitch P in at least a first direction, and a first array () of first light sources () and a second array () of second light sources (), the first light sources () being configured to emit light at a wavelength L, wherein the first light sources () are located at a distance D from the microlens array (), wherein P=2LD/N and N is an integer, and wherein a size of the second light sources () is greater than a size of the first light sources (), such that the light sources of the first array () produce structured light and the light sources of the second array () produce a continuous area of light.

Illumination apparatus

Optoelectronic modules operable to measure proximity independent of object surface reflectivity and, in some implementations, operable to measure characteristics (such as surface reflectivity or absorptivity) of stationary or moving objects are disclosed. The optoelectronic modules are operable to determine, for example, pulse rate, peripheral blood circulation, and/or blood oxygen levels of moving objects, such as the appendage of a user, in some instances. The optoelectronic modules can be used to measure peripheral blood circulation, for example, when a user of the optoelectronic module is engaged in physical activity, such as walking, running or cycling.

Optoelectronic modules and methods for operating the same

This disclosure describes illumination assemblies operable to generate a patterned illumination that maintain high contrast over a wide temperature range. An implementation of the illumination assembly can include an array of monochromatic light sources positioned on an illumination plane, first and second optical elements, and an exit aperture. A chief ray of each light source within the array of monochromatic light sources can substantially converge at an exit aperture. In such implementations light generated by the array of monochromatic light sources can be used efficiently.

Illumination assembly for 3D data acquisition

Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.

Image sensor modules including primary high-resolution imagers and secondary imagers

The illumination module for emitting light () can operate in at least two different modes, wherein in each of the modes, the emitted light () has a different light distribution. The module has a mode selector () for selecting the mode in which the module operates, and it has an optical arrangement. The arrangement includes&#x2014;a microlens array (LL) with a multitude of transmissive or reflective microlenses () which are regularly arranged at a lens pitch P (P);&#x2014;an illuminating unit for illuminating the microlens array (LL). The illuminating unit includes a first array of light sources (S) operable to emit light of a first wavelength Leach and having an aperture each. The apertures are located in a common emission plane which is located at a distance D (D) from the microlens array (LL). In a first one of the modes, for the lens pitch P, the distance D and the wavelength Lapplies P=2&#xb7;L&#xb7;D/N wherein N is an integer with N&#x2265;1.

Multi-mode illumination module and related method

This disclosure describes optical assemblies that generate output with substantial stability over a wide variation in temperature. The optical assemblies can be integrated, for example, as part of array generators arranged to project an array or other pattern of dots onto an object or projection plane.

Athermal optical assembly

A method for manufacturing an optical device comprising providing a plurality of initials bars each having a first side face presented with a first optical component arrangement; positioning the initial bars in a row with their first side faces facing a neighboring one of the initial bars; fixing the initial bars to obtain a bar arrangement; obtaining prism bars by segmenting the bar arrangement by at least one of the steps: conducting a plurality of cuts so that each prism bar comprises a portion of at least two different ones of the initial bars, separating the bar arrangement into sections along cut lines or by creating cut faces at an angle with initial-bar directions; dividing the first optical component arrangement for obtaining a plurality of passive optical components, wherein each prism bar comprises one or more passive optical components comprising a first reflective face each which is of non-planar shape; segmenting prism bars into parts.

Miniaturized optical devices, such as spectrometers and spectrometer modules, and their manufacture

Compact spectrometer modules include an illumination channel and a detection channel. The illumination channel includes an illumination source operable to generate a broad spectrum of electromagnetic radiation. The detection channel includes an illumination detector and a Fabry-Perot component. The Fabry-Perot component is operable to pass a narrow spectrum of wavelengths to the illumination detector. Further, the Fabry-Perot component can be actuatable such that the Fabry-Perot component is operable to pass a plurality of narrow spectrums of wavelengths to the illumination detector.

Compact spectrometer modules

Manufacturing opto-electronic modules () includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack () in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules () can be obtained by separating the wafer stack () into separate modules.

Opto-electronic modules and methods of manufacturing the same and appliances and devices comprising the same

Structured light projection system includes an array of light emitting devices, which is configured to emit a pattern of light. A projection lens is configured to receive and project the pattern of light from the array to a first optical element. The first optical element alters the pattern of light to generate a first emitted pattern of light that is irregular. The first emitted pattern of light is transmitted to a second optical element that is configured to receive the first pattern of light and reproduce the first emitted pattern along a second emitted pattern, which comprises multiple instances of the first emitted pattern arranged in a tiled pattern.

Generating structured light

Growing community of inventors

Jona, Switzerland

Markus Rossi