At&s Austria Technologie & Systemtechnik Aktiengesellschaft

Multiphoton Optics Gmbh

Dyconex Ag

Markus Riester

Gregor Langer

Johannes Stahr

Alexander Stuck

Marc Hauer

Hannes Voraberger

Ruth Houbertz-Krauss

Ruth Houbertz

Gerhard Schmid

A package including optical components has one or more structures with optical input or optical output. An optical interconnection optically connects to the optical input or optical output of the structure(s). A component is provided in which the optical interconnection and the optical input or optical output of the structure(s) are embedded. The component is made of a first material and the optical interconnection of a second material. The first and second materials are chemically identical. The first material has a first primary and/or secondary structure and the second material has a second primary and/or secondary structure. The first primary and/or secondary structure is different from the second primary and/or secondary structure. The refractive indices of the component and of the optical interconnection differ from each other by at least 0.0004 at 850 nm, 1,310 nm, and 1,550 nm, respectively. The optical interconnection is mechanically fixed by the component.

Optical package and a process for its preparation

The present invention is directed to a package including optical components, comprising: (i) at least one structure, the structure having at least one optical input or output, (ii) at least one optical interconnection, optically connected to the at least one optical input or output, and (iii) a component in which the at least one optical interconnection and the at least one optical input or output is embedded, wherein (a) the component (iii) embedding the at least one optical interconnection and the at least one optical input or output and the at least one optical interconnection (ii) are made from a chemically identical material, wherein the material of the at least one optical interconnection has a different primary and/or secondary structure, compared to the material of the component embedding the at least one optical interconnection and the at least one optical input or output, (b) the component (iii) embedding the at least one optical interconnection and the at least one optical input or output and the at least one optical interconnection (ii) have a difference in their refractive indices of at least 0.0004 to 0.0015 at 850, 1310, and 1550 nm, respectively, and (c) the at least one optical interconnection (ii) is mechanically fixed by the component (iii) embedding the at least one optical interconnection and the at least one optical input or output. Further, the invention provides methods for the preparation of the said package.

A method for embedding at least one component into a dielectric layer. obtain a good result, it is provided that the method includes the following steps: a) Position and affix the at least one component on a carrier; b) Cast a liquid dielectric around the at least one component, thereby enclosing the at least one component completely; c) Harden the liquid dielectric to form a solid dielectric layer; and d) Apply, in particular by lamination thereon, another layer, in particular an electrically conductive layer. The use of a dielectric layer formed entirely of liquid dielectric, wherein the liquid dielectric is not converted into a solid state until the dielectric is processed.

Method for embedding electrical components

A method for fixing an electronic component on a printed circuit board, and contact-connecting the electronic component to the printed circuit board, the following steps are provided:&#x2014;providing the printed circuit board having a plurality of contact and connection pads,&#x2014;providing the electronic component having a number of contact and connection locations corresponding to the plurality of contact and connection pads, with a mutual spacing reduced in comparison with the spacing of the contact and connection pads, and&#x2014;arranging or forming at least one interlayer for routing the contact and connection locations of the electronic component between the contact and connection pads and the contact and connection locations of the electronic component. A method for producing an interlayer for routing and a system having a printed circuit board and an electronic component using the interlayer for routing are also provided.

Method for fixing an electronic component on a printed circuit board and system comprising a printed circuit board and at least one electronic component

A printed circuit board element () with a substrate (), with at least one optoelectronic component () embedded in a photopolymerizable optical layer material (), and with at least one optical waveguide () optically coupled with the former and structured in the optical material by photon absorption, wherein a prefabricated deflection mirror () embedded in the optical material () and optically coupled with the optoelectronic component () via the optical waveguide () is arranged on the substrate (), optionally together with a support (').

Printed circuit board element and method for producing the same

The invention relates to a printed circuit board element () including at least one optoelectronic component () which is embedded in an optical, photopolymerizable layer material (), and at least one optical waveguide () optically coupled thereto, which is structured in the optical, photopolymerizable material () by photon irradiation, wherein the component () comprises a curved deflection mirror () on its light transmission surface (), which curved deflection mirror deflects the light radiation (), for instance by 90&#xb0;.

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Seiersberg, Austria

Markus Riester