Infineon Technologies Ag

Markus Meyer

Wolfgang Lehnert

Stefan Pompl

Michael Stadtmueller

Wolfgang Klein

Karolina Zogal

Alexandra Marina Roth

Karolina Gierl

Werner Breuer

Jorge Eduardo Adatti Estevez

In accordance with an embodiment, a gas-sensitive device includes a substrate structure, and a gas sensitive capacitor. The gas sensitive capacitor a first capacitor electrode in form of a gas-sensitive layer on a first main surface region of an insulation layer, and a second capacitor electrode in form of a buried conductive region below the insulation layer, so that the insulation layer is arranged between the first and second capacitor electrode. The gas-sensitive layer comprises a sheet impedance which changes in response to the adsorption or desorption of gas molecules.

Gas-sensitive device

A method for manufacturing an electronic component includes providing a substrate and a functional layer supported by the substrate; forming a structured protection layer on a side of the substrate to which the functional layer is attached, wherein the structured protection layer has a recess so that a portion of the functional layer is exposed; applying a dispersion comprising a solvent and electrically conductive components to the exposed portion of the functional layer so that the recess is at least partially filled with the dispersion; drying the dispersion in order to create an electrically conductive layer; and removing the structured protection layer.

Method for manufacturing an electronic component

A MEMS-transducer comprises a membrane structure having a first main surface and a second main surface opposing the first main surface. A substrate structure holds the membrane structure, wherein the substrate structure overlaps with the first main surface of the membrane structure in a first edge region being adjacent to a first inner region of the first main surface. A gap is formed between the membrane structure and the substrate structure in the first edge region and extends from the first inner region into the first edge region.

MEMS-transducer and method for producing a MEMS-transducer

A method for manufacturing a semiconductor device and a semiconductor device are disclosed. The method comprises forming a trench in a substrate, partially filling the trench with a first semiconductive material, forming an interface along a surface of the first semiconductive material, and filling the trench with a second semiconductive material. The semiconductor device includes a first electrode arranged along sidewalls of a trench and a dielectric arranged over the first electrode. The semiconductor device further includes a second electrode at least partially filling the trench, wherein the second electrode comprises an interface within the second electrode.

Capacitor and method of forming a capacitor

In one embodiment a method of forming a compressive polycrystalline semiconductive material layer is disclosed. The method comprises forming a polycrystalline semiconductive seed layer over a substrate and forming a silicon layer by depositing silicon directly on the polycrystalline silicon seed layer under amorphous process conditions at a temperature below 600 C.

Growing community of inventors

Sinzing, Germany

Markus Meyer