Robert Boschgmbh

Markus Menacher

Hendrik Jahnle

Bernd Beiermeister

Norman Lung

Victor Roman

Dieter Ludwig

The invention relates to a method () for establishing a connection between an inlay () and a polymer () at least partially surrounding the inlay, wherein a monomer () is brought into contact () with the inlay () and is subsequently polymerized () to form the polymer (), wherein the temperature TE of the inlay () is increased () at least briefly at least to that temperature TM that the monomer () assumes at its maximum during its exothermic polymerization () to form the polymer (), and/or that ensures that the heat flow always runs from the inlay () to the monomer (). The invention also relates to a method (), (), () for the sealing integration of an inlay () in a component (). The invention also relates to a device () for carrying out the method (), comprising a conveyor () for a lead frame () in which a multiplicity of inlays () are able to be fed, and an at least two-part () mould () which is closable about an individual inlay () and has a feed () for feeding the monomer () into the space () between the mould () and the inlay (), wherein a current supply () is provided for the resistive and/or inductive heating () of the inlay () surrounded by the mould ().

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Ingersheim, Germany

Markus Menacher