Robert Boschgmbh

Sitime Corporation

Leland Stanford Junior University

Other

Akustica, Inc.

Robert Bosh Gmbh

Sitime Corpoaration

Markus Lutz

Aaron Partridge

Pavan Gupta

Silvia Kronmueller

Charles I Grosjean

Paul Merritt Hagelin

Michael Offenberg

Ginel C Hill

Renata Melamud Berger

Karsten Funk

Horst Muenzel

Zhiyu Pan

Brian H Stark

Joerg Hauer

Reinhard Neul

Klaus Heyers

Gary Yama

Burkhard Kuhlmann

Wilhelm Frey

Joseph C Doll

Jochen Franz

Wolfram Bauer

Christian Doering

Rainer Willig

Franz Laermer

Udo-Martin Gomez

Eckhard Graf

Bernhard Boser

Crist Y Lu

Sassan Tabatabaei

Jasim Ahmed

Kurt Weiblen

Markus Ulm

Helmut Baumann

Frank Fischer

Stefan Pinter

Thomas W Kenny

Erich Zabler

Andrea Schilp

Frieder Haag

Aleksandar Kojic

Nicholas Miller

Yi Zhang

Udo Bischof

Andreas Thomae

Siegbert Goetz

Dietrich Schubert

Michael Fehrenbach

Gerhard Wucher

Carl Arft

Alexandra Boehringer

Andreas Kipp

Bernhard Elsner

Matthias Metz

Robert N Candler

Nicholas Buchan

Detlef Clawin

Kamran Souri

Frank Reichenbach

Juergen Kurle

Dirk Foerstner

Georg Bischopink

Harald Emmerich

Jean-Pierre Hathout

Johannes Artzner

Dietmar Arndt

Joerg Wolf

Ralf Hausner

Heinz-Georg Vossenberg

Martin Schoefthaler

Jens Mohaupt

Horst Munzel

Ralf Schellin

Helmut Skapa

Karl Bender

Peter Sulzberger

Joerg Kaienburg

Jurgen Kurle

Udo Gomez

Volker Materna

Siegbert Geotz

Bernd Maihoefer

Wolfgang Buchholtz

Aaron Patridge

Yushu Ma

Sassan Tabatabaei Zavareh

Li Ko Chiu

Pan Zhiyu

Trushal Chokshi

Burhard Kuhlmann

A microelectromechanical system (MEMS) device is provided with partitioning for thermal management. In one illustrative embodiment, the device may include: a heated section including a first die and a second die, wherein: the first die includes a heater, and the second die is coupled to the first die and includes a temperature sensor and a MEMS resonator; and a non-heated section communicatively coupled to the heated section and including a third die. The third die may receive a first signal associated with the temperature sensor and provides a second signal to the first die associated with the heater based on the first signal.

Microelectromechanical system oven-controlled oscillator

A microelectromechanical system (MEMS) resonator includes a substrate having a substantially planar surface and a resonant member having sidewalls disposed in a nominally perpendicular orientation with respect to the planar surface. Impurity dopant is introduced via the sidewalls of the resonant member such that a non-uniform dopant concentration profile is established along axis extending between the sidewalls parallel to the substrate surface and exhibits a relative minimum concentration in a middle region of the axis.

Non-lid-bonded MEMS resonator with phosphorus dopant

The present inventions, in one aspect, are directed to micromachined resonator comprising: a first resonant structure extending along a first axis, wherein the first axis is different from a crystal axis of silicon, a second resonant structure extending along a second axis, wherein the second axis is different from the first axis and the crystal axis of silicon and wherein the first resonant structure is coupled to the second resonant structure, and wherein the first and second resonant structures are comprised of silicon (for example, substantially monocrystalline) and include an impurity dopant (for example, phosphorus) having a concentrations which is greater than 10cm, and preferably between 10cmand 10cm.

Resonant elements and oscillators

A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead. A MEMS resonator chip is mounted to the resonator-control chip in a stacked die configuration and the MEMS resonator chip, resonator-control chip and internal electrical contact and die-mounting surfaces of the electrical lead are enclosed within a package enclosure that exposes the external electrical contact surface of the electrical lead at an external surface of the packaging structure.

MEMS resonator integrated cicruit fabrication

MEMS resonator with colocated temperature sensor

MEMS resonator system

One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operate—in effect, heating the MEMS component and optionally related circuitry to a steady-state 'oven' temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).

Ovenized MEMS

MEMS resonator with beam segments having predefined angular offset to each other and to resonator silicon crystal orientation

In various time-transfer systems, one or more fixed-position time beacons broadcast radio-frequency (RF) time-transfer messages to time-keeping modules disposed in remote radio heads and other strategic locations to achieve highly reliable and accurate synchronized time, phase, and frequency transfer over a metropolitan or other wide-field area.

Time module apparatus for use with fixed-beacon time transfer system

Multi-die integrated circuit package

MEMS resonator with co-located temperature sensor

Stacked-die MEMS resonator

A semiconductor layer having an opening and a MEMS resonator formed in the opening is disposed between first and second substrates to encapsulate the MEMS resonator. An electrical contact that extends from the opening to an exterior of the MEMS device is formed at least in part within the semiconductor layer and at least in part within the first substrate.

Microelectromechanical structure with bonded cover

One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operate&#x2014;in effect, heating the MEMS component and optionally related circuitry to a steady-state 'oven' temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).

Growing community of inventors

Palo Alto, CA, United States of America

Markus Lutz