Epcos Ag

Tdk Electronics Ag

Markus Koini

Michael Schossmann

Günter Engel

Christian Hoffmann

Jürgen Konrad

Andrea Testino

Franz Rinner

Thomas Wippel

Markus Puff

Monika Stadlober

Christoph Auer

Georg Kügerl

Stefan Obermair

Markus Ortner

Thomas Feichtinger

Bernhard Döllgast

Fabian Beck

Guenter Engel

Manfred Schweinzger

Johann Pichler

Nele Reimer

Juergen Konrad

Florian Böhm

An electronic device is disclosed. In an embodiment an electronic device includes at least one first carrier and at least one semiconductor chip, wherein the first carrier has a cavity in which the semiconductor chip is arranged.

Electronic device

A multilayer component is disclosed. In an embodiment, a multilayer component includes a main body with first and second inner electrodes, wherein the first and second electrodes are alternately arranged in an interior of the main body and electrically insulated from one another and an outer contact configured to provide external contact, wherein the outer contact comprises at least two first strip-shaped conductor tracks arranged on a first surface of the main body, wherein each first conductor track is electrically connected to one of the first inner electrodes, wherein the outer contact comprises at least two second strip-shaped conductor tracks arranged on a second surface of the main body, wherein each second conductor track is electrically connected to one of the second inner electrodes, and wherein embossings in adjacent first conductor tracks or second conductor tracks are arranged offset with respect to one another.

Multilayer component with external contact

An electrical component having partial bodies, a base on which the partial bodies are arranged, and at least one connection contact for electrically connecting the partial bodies to a carrier. A method for producing an electrical component having one or more partial bodies is also disclosed.

Electrical component and a method for producing an electrical component

A module having a power semiconductor device and a ceramic capacitor which is configured for cooling the power semiconductor device.

Power module with capacitor configured for improved thermal management

An electrical connection contact () for a ceramic component () is specified. The connection contact () comprises a first material (M) and a second material (M) arranged thereon, wherein the first material (M) has a high electrical conductivity and the second material (M) has a low coefficient of thermal expansion.

Electrical connection contact for a ceramic component, a ceramic component, and a component arrangement

The present invention relates to a capacitor assembly () which comprises at least one ceramic multilayer capacitor () comprising ceramic layers () and first and second electrodes () arranged therebetween, and a base (). The base () comprises a substrate () and conductor tracks (), wherein the conductor tracks () lead from a top side () of the substrate () said top side facing toward the multilayer capacitor (), to an underside () of the substrate (), said underside facing away from the multilayer capacitor (). The multilayer capacitor () is mechanically secured on the base (). The first electrodes () and the second electrodes () are electrically contacted with the conductor tracks ().

Capacitor assembly

A filter component for filtering an interference signal. The filter component includes at least one multilayer ceramic capacitor having a main body, in which multiple ceramic layers and internal electrodes are stacked one above another, and connection contacts are arranged at the main body. The ceramic layers include a lead lanthanum zirconate titanate ceramic, for example.

Filter component for filtering an interference signal

A ceramic material for capacitors using multilayer technology of formula (I): PbAB(ZrTi)CSiO+y&#xb7;PBO wherein A is selected from the group consisting of La, Nd, Y, Eu, Gd, Tb, Dy, Ho, Er and Yb; C is selected from the group consisting of Ni and Cu; and 0&#x3c;a&#x3c;0.12, 0.05&#x2264;x&#x2264;0.3, 0&#x2264;c&#x3c;0.12, 0.001&#x3c;e&#x3c;0.12 and 0&#x2264;y&#x3c;1.

Ceramic material and capacitor comprising the ceramic material

A capacitor arrangement includes at least one ceramic multilayer capacitor with a main body having ceramic layers and first and second electrode layers arranged therebetween. The capacitor also has a first external contact and a second external contact on mutually opposite side surfaces. The first external contact is electrically conductively connected to the first electrode layers and the second external contact is electrically conductively connected to the second electrode layers. A contact arrangement includes two metallic contact plates, between which the at least one ceramic multilayer capacitor is arranged. The first and second external contacts are electrically conductively connected in each case to one of the metallic contact plates.

Capacitor arrangement

A ceramic multi-layer capacitor includes a main body, which has ceramic layers arranged along a layer stacking direction to form a stack, and first and second electrode layers arranged between the ceramic layers. The multi-layer capacitor also includes a first external contact-connection arranged on a first side surface of the main body and electrically conductively connected to the first electrode layers, and a second external contact-connection arranged on a second side surface of the main body. The second side surface is situated opposite the first side surface and is electrically conductively connected to the second electrode layers.

Ceramic multi-layered capacitor

An electrical component is disclosed. In an embodiment the component includes a component body and at least one connection element having a plastic body, wherein the at least one connection element is connected to the component body via a metal layer.

Electrical component comprising a connection element having a plastic body

A multi-layer capacitor has dielectric layers and electrode layers arranged therebetween. The multi-layer capacitor has a number of segments that are connected to one another. At least one relief region is provided between the segments. The invention furthermore provides a method for producing such a multi-layer capacitor.

Multi-layer capacitor and method for producing a multi-layer capacitor

A ceramic multi-layer capacitor includes a main body, which has ceramic layers arranged along a layer stacking direction to form a stack, and first and second electrode layers arranged between the ceramic layers. The multi-layer capacitor also includes a first external contact-connection arranged on a first side surface of the main body and electrically conductively connected to the first electrode layers, and a second external contact-connection arranged on a second side surface () of the main body (). The second side surface is situated opposite the first side surface and is electrically conductively connected to the second electrode layers.

An electrical device having at least one functional element that includes a ceramic body, on which a first electrical contact layer and a second electrical contact layer are applied to two opposite-lying side faces, respectively, and the functional element is arranged between a first contact strip and a second contact strip, wherein the first contact strip and the second contact strip comprise several contact pins, respectively, and wherein the first contact layer electrically contacts at least one contact pin of the first contact strip and the second contact layer electrically contacts at least one contact pin of the second contact strip.

Growing community of inventors

Seiersberg, Austria

Markus Koini