Osram Opto Semiconductors Gmbh

Osram Opto Semiconductor Gmbh

Markus Kirsch

Tony Albrecht

Thomas Zeiler

Stefan Gruber

Thomas Schlereth

Christian Gaertner

Albert Schneider

Michael Bestele

Herbert Brunner

Georg Bogner

Reiner Windisch

Julius Muschaweck

Stephan Kaiser

Jan Marfeld

Hans-Christoph Gallmeier

Roland Schulz

Torsten Baade

Christian Gärtner

Steffen Köhler

Rainer Sewald

Simon Bluemel

Stefan Handl

An optoelectronic component device includes a plurality of optoelectronic components that provide and/or absorb electromagnetic radiation; a reflector arranged in a beam path of the electromagnetic radiation of the plurality of optoelectronic components and which has a surface that is at least partly reflective with respect to the provided electromagnetic radiation; wherein the plurality of optoelectronic components at least partly surround the reflector or are at least partly surrounded by the reflector; and the reflector reflects a provided electromagnetic radiation such that a predefined field distribution of the reflected electromagnetic radiation is formed in the image plane of the optoelectronic component device.

Optoelectronic component device, method of producing an optoelectronic component device, and method of operating an optoelectronic component device, method of operating an optoelectronic device having improved emission characteristics

A ring light module having a plurality of optoelectronic semiconductor components for producing electromagnetic radiation, a reflector of the ring light module comprising a reflective surface, and a support. The semiconductor components are mounted on the support. In a plan view of a main radiation side of the ring light module, the reflector comprises at most two planes of symmetry. The reflector tapers in the direction towards the main radiation side. At least some of the main emission directions of adjacent optoelectronic semiconductor components are oriented differently from each other, and the main emission directions point towards the reflective surface.

Ring light module

A semiconductor chip () is provided which comprises:

Monolithic semiconductor chip array

A plastic housing is arranged on a carrier element and is provided with a recess in which an optoelectronic component is arranged. On the side facing away from the carrier element, the recess has an opening to the outside which can be provided with a transparent cover. One or more structures can be provided on the plastic housing in order to orient the cover and/or optical components relative to the optoelectronic component.

Optoelectronic component disposed in a recess of a housing and electrical componenet disposed in the housing

A housing body for an optoelectronic component comprises a main surface having a first area region and a second area region. The first area region and the second area region form a step in the main surface. The first area region and the second area region adjoin one another by means of an outer edge. The second area region and the outer edge enclose the first area region.

Optoelectronic device with housing body

A method for producing an arrangement of optoelectronic components () is specified, comprising the following steps: producing at least two fixing regions () on a first connection carrier (); introducing solder material () into the fixing regions (); applying a second connection carrier () to the fixing regions (); and soldering the second connection carrier () onto the first connection carrier () with the solder material () in the fixing regions ().

Arrangement of optoelectronic components

According to at least one embodiment of the semiconductor arrangement, the latter comprises a mounting side, at least one optoelectronic semiconductor chip with mutually opposing chip top and bottom, and at least one at least partially radiation-transmissive body with a body bottom, on which the semiconductor chip is mounted such that the chip top faces the body bottom. Moreover, the semiconductor arrangement comprises at least two electrical connection points for electrical contacting of the optoelectronic semiconductor chip, wherein the connection points do not project laterally beyond the body and with their side remote from the semiconductor chip delimit the semiconductor arrangement on the mounting side thereof.

Semiconductor arrangement

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Brunn, Germany

Markus Kirsch