Carl-zeiss-stiftung

Markus Kasparek

Franz Sorg

Michael Trunz

Uwe W Hamm

Frank Marianek

Karlfried Osterried

Oliver Jacobs

Michael Ebert

A process for the structuring of a substrate with structures in the micrometer to nanometer range that does not involve the provision of gaseous fluoro-organic compounds is described. The process is carried out by means of reactive ion etching using a mask arranged on the substrate and a plasma as well as fluorine-containing organic compounds, which fluorine-containing organic compound(s) is/are provided in the form of solid polymers. A process for the etching of a coating on a substrate or the surface of a substrate is also described.

Process for the structuring of a substrate

A device for the low-deformation support of an optical element ( ), in particular of an end plate of a lens in a projection printing system for semiconductor elements, is provided with a mount ( ), the optical element ( ) being connected to the mount ( ) at least partly via a bonding layer which is located between the adjacent circumferential walls ( ) of mount ( ) and optical element ( ). The mount ( ) is provided with at least three bearing feet ( ) which are distributed over the circumference and on which the optical element ( ) rests. The bonding layer is located in an annular gap ( ) between the adjacent circumferential walls ( ) of mount ( ) and optical element ( ) over at least one section thereof.

Device for the low-deformation support of an optical element and method for the low-deformation support of the optical element

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Oberkirch/Baden, Germany

Markus Kasparek