Jds Uniphase Corporation

Viavi Solutions Inc.

Other

Viavi Solutions Suzhou Co., Ltd.

Markus K Tilsch

Georg J Ockenfuss

Richard Ian Seddon

Marius Grigonis

Andrew Clark

Robert E Klinger

Jeremy Hayes

Richard Alan Bradley, Jr

Joseph Stork Smith

Benjamin F Catching

Adam Preuss

Robert E Hahn

Frederik Kevin Zernik

Andy Shkabko

Ralf Erz

Adam Bergeron

Nicolas Alexander Davis

Anthony Jay Kemp Cottrell

Russell Edward Barbaria

Neil Pinkerton

Eric Nybank

Yinxiang Xia

Donggong Peng

Zhao Yuan

Ailing Ding

Weibin Huang

In some implementations, a wafer holder apparatus includes a jig structure to receive a wafer, wherein the jig structure includes a first angled surface with respect to a nominal coating plane; and a spring structure to compress an end of the wafer against the first angled surface, wherein the spring structure includes: a spring; and a compression surface attached to the spring, wherein the compression surface includes a second angled surface matched to the first angled surface.

Wafer manufacturing apparatus

A device may include one or more memories and one or more processors, communicatively coupled to the one or more memories, to receive design information, wherein the design information identifies desired values for a set of layers of an optical element to be generated during one or more runs; receive or obtain historic information identifying a relationship between a parameter for the one or more runs and an observed value relating to the one or more runs or the optical element; determine layer information for the one or more runs based on the historic information, wherein the layer information identifies run parameters, for the set of layers, to achieve the desired values; and cause the one or more runs to be performed based on the layer information.

Coating control using forward parameter correction and adapted reverse engineering

A coating system may include a coating chamber; a substrate holder to move a substrate along a motion path; and a sensor device in the coating chamber, wherein the sensor device is configured to move along the motion path, and wherein the sensor device is to perform a spectral measurement on the substrate.

Optical monitor

A device including a hard shield material; a layer including aluminum or copper; and a silicon layer having a first thickness is disclosed. The device can also include a silicon layer having a second thickness. A method of making the device is also disclosed.

Silicon coating on hard shields

A method and sputter-deposition system for depositing a layer composed of a mixture of materials and having a predetermined refractive index are provided. The sputter-deposition system includes a plurality of target cathodes, each of which comprises a target material having a different composition, that are powered by a single DC power supply. The plurality of target cathodes are cosputtered to deposit a layer composed of a mixture of materials on a substrate. The composite refractive index of the layer is controlled by adjusting an operating parameter of the plurality of target cathodes. Suitable operating parameters include cathode power, cathode voltage, cathode current, an angle between a cathode support and the substrate, and a flow rate of a reactive gas.

Method and sputter-deposition system for depositing a layer composed of a mixture of materials and having a predetermined refractive index

A method and control system are provided for depositing a layer in a sputter-deposition system having a target cathode. A first dependence relationship of a deposition rate of the layer on an operating parameter, selected from cathode voltage, cathode current, and cathode power, is provided prior to deposition of the layer. A second dependence relationship of the operating parameter on time is measured during deposition of the layer, while a different operating parameter, also selected from cathode voltage, cathode current, and cathode power, is held substantially constant. On the basis of the first and second dependence relationships, a deposition time for the layer is dynamically determined during deposition of the layer.

Method and control system for depositing a layer

The present invention relates to a magnetron sputtering device and technique for depositing materials onto a substrate at a high production rate in which the deposited films have predictive thickness distribution and in which the apparatus can operate continuously and repeatedly for very long periods. The present invention has realized increased production by reducing cycle time. Increased coating rates are achieved by coupling a planetary drive system with a large cathode. The cathode diameter is greater than the diameter of a planet and less than twice the diameter of the planet. Lower defect rates are obtained through the lower power density at the cathode which suppresses arcing, while runoff is minimized by the cathode to planet geometry without the use of a mask.

Magnetron sputtering device

A device for mounting and removing a substrate from a baseplate, in particular a substrate holder assembly device, including automated features for latching and unlatching a substrate, for use in a coating mechanism, from a baseplate, which includes an adjustable snap ring holder.

Substrate holder assembly device

A magnetron sputtering cathode for use in a vacuum deposition process is disclosed wherein the cathode is coated on its sides with an electrically insulating material such as alumina to prevent arcing, and wherein the first end surface of the cathode supports a material to be sputtered. The bottom of the cathode may also be coated with an electrically insulating coating or may be resting upon an insulating platform.

Cathode for sputter coating

The invention relates to a magnetic latch for securing substrates on a planetary rotating platform suspended above a coating source in a vacuum chamber of a vapor deposition system, e.g. a chemical vapor deposition (CVD) system or a physical vapor deposition (PVD) system. The magnetic latch includes a permanent magnetic, which is moveable between a latching position, in which the permanent magnet magnetizes the latch for attracting a substrate holder, and an unlatching position, in which the permanent magnet is connected in a bypass circuit, thereby demagnetizing the latch for releasing the substrate holder.

Magnetic latch for a vapour deposition system

A wavelength-tunable add/drop device for adding or dropping n channels having different center wavelengths is disclosed. A first multicavity variable optical filter for selectably operable to passing one channel while reflecting n&#x2212;1 other channels depends upon a location where light is launched into an end of the multicavity optical filter. A broadband optical reflector is disposed directly adjacent to the multicavity variable optical filter and disposed between planes coincident with the first and second surfaces of the variable filter, the broadband reflector having a reflectivity that will reflect all n channels of light. Preferably, the broadband reflector is disposed distal from the bottom and top layers of the multicavity filter and is adjacent to the middle layers or near the middle of the multicavity filter layers.

Tunable optical add/drop device

Thin film filters have been a basic building block of many wavelength division multiplexed (WDM) systems providing the means by which a signal, defined by a center wavelength, can be separated from a group of WDM signals. In an effort to maintain the same performance over a range of operating temperatures, thin film filters have been coated onto specially designed substrates, which expand and contract with the change in temperature to counteract the effects that the temperature change has on the thin film filters. Unfortunately, only very few materials provide the necessary thermal expansion characteristics to counteract the shift in center wavelength. Moreover, the application of a force onto only one side of the filter causes the thin film filter to bend or curve. Accordingly, the present invention solves the aforementioned problems by providing a thin film filter sandwiched between a substrate and a superstrate, which apply equal forces to each side of the filter. The present invention also includes an actively tunable thin film filter assembly, which utilizes stress applying devices, e.g. heaters or piezo-electric crystals, to adjust signal characteristics, such as the bandwidth, the group delay, and the chromatic dispersion, as desired.

Growing community of inventors

Santa Rosa, CA, United States of America

Markus K Tilsch