Vitesco Technologies Germany Gmbh

Markus Heckel

Johannes Bock

Jürgen Sauerbier

Thomas Rumrich

Juergen Hornberger

The disclosure provides a circuit board that includes: a carrier element having a number of circuit board layers; a number of electronic components; a number of thermal interfaces; and a number of electrical interfaces. The electronic components are arranged directly on at least one of the surface sides on the carrier element. The opposite surface side of the carrier element is of potential-free design. Additionally, the circuit board with the electronic components is overlaid by a covering material in such a way that the electronic components are mechanically stabilized and the thermal and/or electrical interfaces are free of the covering material.

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Schwabach, Germany

Markus Heckel