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Arges Gmbh

Arges Gesellschaft Für Industrieplanung Und Lasertechnik M.b.h.

Markus Guggenmos

Martin Hartmann

Roberto Tiziani

Paolo Crema

Christiaan H F Velzel

Bernhard Kiesbauer

Sven Pekelder

Rinze Frederik Van Der Kluit

Christiaan Hf Velzel

Christiaan HF Velzel

Daniel Schwab

Manuel Berger

The present invention is directed to an optical system for measuring the rotation angle of rotatable object having a rotation shaft (), which system comprises a reflective diffraction element () mounted on said shaft and a module that includes a radiation source () emitting a monochromatic beam (bo) towards this element and a radiation-sensitive detection structure (), the diffraction element is configured to project diffraction order images () of its pattern onto associated sections (()-()) of an annular grating structure forming part of the detection structure and the surface size of the diffraction element is smaller than 20% of the surface size of the annular grating structure.

Optical rotation angle measuring system

The invention relates to a method for the highly precise regulation of load-variable heat sources or heat sinks, and to a device for controlling the temperature of a dynamic heat source, especially of pump diodes for solid-state lasers. According to said method, the calculated mean value of the forward flow temperature and the return flow temperature is preset as an actual value for regulating the power, in order to ensure a stabilization of the heat source even without any information on the type of thermal load and the heat quantity to be dissipated, by the mean reference temperature for the heat flow to or from the temperature-controlling medium being maintained at a constant value irrespective of the heat quantity to be dissipated. As far as the device is concerned, a return flow temperature measuring device is provided in addition to a forward flow temperature measuring device arranged in the pump diode coolant circuit, both measuring devices being connected to an analog or digital computing unit which performs a mean value calculation in order to determine a refrigerating capacity set value transmitted to corresponding switching devices for the regulation of the load.

Method for the highly precise regulation of load-variable heat sources or heat sinks, and device for controlling the temperature of a dynamic heat source, especially pump diodes for solid-state lasers

A method for removing residues of molding material from metal parts of plastic packages of semiconductor devices includes applying first and second pulsed laser radiations to at least one surface region of a metal part covered with residues of molding material. The first pulsed laser radiation has a first wavelength that is absorbed by residues of molding material having a thickness greater than a prescribed thickness. The intensity and the duration of the first pulsed laser radiation causes the residues to be directly attacked. The second pulsed laser radiation has a second wavelength so that residues of molding material having a thickness less than the prescribed value are at least partially transparent and the metal parts are at least partially absorbent. The intensity and the duration of the second pulsed laser radiation causes the formation of plasma at the point of impact with the metal part.

Method for removing molding residues in the fabrication of plastic packages for semiconductor devices

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Schwandorf, Germany

Markus Guggenmos