Micronit Microfluidics B.v.

Micronit Microtechnologies B.v.

Other

Nxp B.v.

Janssen Pharmaceutica Nv

Ce-mate B.v.

Micronit Microfluids B.v.

Medimate Holding B.v.

Marko Theodoor Blom

Ronny Van 't Oever

Marinus Bernardus Olde Riekerink

Johannes Oonk

Ronny Van't Oever

Jeroen Haneveld

Wilfred Buesink

Peter Tijssen

Amitava Gupta

Lieven Jozef Stuyver

Jean-Christophe Roulet

Jean-Noël Fehr

Steven Selwyn Staal

Jan Floris

Elwin Xander Vrouwe

Simon Reuvekamp

Bieke Van Dorst

Arenda Hendrika Jacoba Koelewijn-Hubers

Manjeet Dhindsa

Michael Christiaan Mulder

Jordan Macleod Macinnes

Raymond William Kenneth Allen

Elfried Van Der Sar

Monica Brivio

Hendrik Jan Hildebrand Tigelaar

Simone Tanzi

Arenda Hendrika Jacoba Koelwijn-Hubers

Ronny VAN'T Oever

Ronny Van 'T Oever

Michaël Christiaan Mulder

The invention relates to a device (), comprising:

Device and method for activating a capillary-stop valve of a device

The invention relates to a channel for trapping particles to be fed to the channel with a fluid. The invention further relates to a flow cell comprising such a channel. The invention also relates to an assembly comprising such a flow cell and a detection means. The invention also relates to a method for trapping particles in such a channel. And finally, the invention relates to a method for analyzing a sample using such an assembly.

Channel for trapping particles to be fed to said channel with a fluid

A method for forming an electrically conductive via in a substrate that includes the steps of: forming a through hole in a first substrate; bringing a first surface of a second substrate into contact with the first surface of the first substrate, such that the through hole in the first substrate is covered by the first surface of the second substrate; filling the through hole in the first substrate with an electrically conductive material by electroplating to form the electrically conductive via, and removing the second substrate, wherein the first surface of the first and the second substrate each have a surface roughness Rof less than 2 nm, preferably less than 1 nm, more preferably less than 0.5 nm, and the first surface of the first and the second substrate are brought in direct contact with each other, such that a direct bond is formed there between.

Method for forming an electrically conductive via in a substrate

The invention relates to a method for manufacturing microfluidic chips having at least one capillary for through-flow of a fluid, comprising the steps of: The invention further relates to a device for functionalizing microfluidic chips having at least one capillary for through-flow of a fluid, said device comprising a material holder for holding a starting material in a fixed position during functionalization, said material holder comprising at least one inlet connector for connecting at least one shared capillary formed in the starting material to a functionalization fluid supply. The invention further relates to a microfluidic chip and a device for holding a microfluidic chip.

Method for manufacturing microfluidic chips, device for functionalizing microfluidic chips, microfluidic chip and device for holding a microfluidic chip

The invention relates to method for bonding at least two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, and an intermediate thin film metal layer.

Method of bonding two substrates and device manufactured thereby

Measurement device () for taking a liquid sample, comprising: a measurement portion () with a measurement surface (), for being in use contacted with the liquid surface and a plug portion () having a plurality of electrical contacts (), wherein the plug portion () is mountable to a socket () of a measurement evaluation apparatus ().

Test chip with plug for measuring the concentration of an analyte in a liquid, housing for test chip and socket for plug

An assembly comprising at least one microfluidic device and a mounting piece, this microfluidic device comprising at least one material layer and at least one first fluidic port, which first fluidic port it situated at least partially in an end surface of the material layer and which mounting piece comprises at least one fluidic component, wherein the mounting piece is coupled to the microfluidic device by means of first coupling means provided for this purpose such that the fluidic component is connected to the first fluidic port. The invention also relates to such a mounting piece.

Assembly of at least one microfluidic device and mounting piece

A micromixing chamber, roughly in the form of an hourglass, having a first outer end with a tangential inflow opening and a second outer end with a tangential outflow opening. The mixing chamber in the overall flow direction first narrows more or less gradually and subsequently widens more or less abruptly. The micromixer may be made at least partially of glass, or at least partially of a plurality of glass plates. A micromixer having a plurality of such micromixing chambers connected fluidically in series is also disclosed. Methods for manufacturing such a micromixing chamber of such a micromixer, as well as method for mixing by means of such a micromixing chamber or by means of such a micromixer, are disclosed.

Micromixing chamber, micromixer comprising a plurality of such micromixing chambers, methods for manufacturing thereof, and methods for mixing

A system for fluidic coupling and uncoupling of fluidic conduits and a microfluidic chip, wherein the fluidic conduits are connected mechanically to a first structural part and the microfluidic chip is carried by a second structural part. The structural parts are moved perpendicularly toward and away from each other by means of a mechanism provided for this purpose. Outer ends of the fluidic conduits can thus be moved over a determined distance substantially perpendicularly to the outer surface of the microfluidic chip and connecting openings in the outer surface of the microfluidic chip. This enables accurate realization of fluidic coupling and uncoupling without the occurrence of undesirable moments of force and with minimal risk of damage to the fluidic conduits or the connecting openings. With such system requirements which can be set in respect of convenience, speed, temperature resistance, sealing, chemical resistance, reproducibility and so forth, can be fulfilled.

Device and method for fluidic coupling of fluidic conduits to a microfluidic chip, and uncoupling thereof

Aspects of the invention include methods and devices for manufacturing and testing microfluidic chips having at least one capillary for through-flow of a fluid.

Method for manufacturing and testing micro fluidic chips

Growing community of inventors

Enschede, Netherlands

Marko Theodoor Blom