Tactotek Oy

Marko Suo-Anttila

Mikko Heikkinen

Tomi Simula

Tapio Rautio

Outi Rusanen

Johanna Juvani

Miikka Kärnä

Mika Paani

A structure includes a first substrate film and a functional electronics assembly. The first substrate film comprises a recess defining a volume. The functional electronics assembly comprises at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion. The functional electronics assembly is connected to the first substrate film via the at least one connection portion. The at least one electronics component is arranged at least partly into the volume. At least part of the at least one electronics component is embedded into a first material arranged into the recess.

Method of manufacture of a structure and structure

A method of manufacture of a structure includes obtaining or producing a functional electronics assembly including at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion, providing the functional electronics assembly on a first substrate film, wherein the functional electronics assembly is connected to the first substrate film via the at least one connection portion, and providing first material to at least partly embed the at least one electronics component into the first material. The first substrate film is adapted to include a recess defining a volume, and the at least one electronics component is arranged at least partly in the volume.

Growing community of inventors

Oulunsalo, Finland

Marko Suo-Anttila