Atotech Deutschland Gmbh

Atotech Deutschland Gmbh & Co. Kg

Markku Lager

Dirk Tews

Wonjin Cho

Michael Merschky

Stefanie Ackermann

Fabian Michalik

Gabriela Schmidt

Thomas Thomas

Martin Thoms

Norbert Lützow

Arno Clicque

Marco Haryono

Felix Tang

Toshio Honda

Mirko Kloppisch

Cedric Lin

Aaron Hahn

The present invention relates to a method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer, the method comprising in this order the steps:

Method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer

The present invention relates to a specific azole silane compound, an oligomer thereof, a mixture comprising said compound and/or said oligomer, as well as a respective storage and working solution. Furthermore, the present invention relates to a synthesis method for said specific azole silane compound, and the use of said working solution as a surface treatment solution.

Azole silane compound

A method for manufacturing a printed circuit board, comprising in order steps (i) providing a non-conductive substrate having on a surface copper circuitry with a copper surface, wherein said surface is chemically treated by (a) oxidation and subsequent reduction reaction and/or (b) organic compound attached to said surface, a permanent, non-conductive, not fully polymerized cover layer covering at least partially said surface, (ii) thermally treating the substrate with the cover layer at temperature from 140&#xb0; C. to 250&#xb0; C. in atmosphere containing molecular oxygen at 100000 ppm or less, based on the total volume of the atmosphere, wherein a substrate with a permanent, non-conductive cover layer is obtained, with the provisos that (ii) is after (i) but before any metal or metal alloy is deposited onto the cover layer, and that in (ii) the cover layer is fully polymerized in one thermal treating step, if the cover layer is a solder mask.

Method for manufacturing a printed circuit board

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Berlin, Germany

Markku Lager