Entorian Technologies LP

Dell Products Inc.

Augmentix Corporation

Mark Wolfe

James Douglas Wehrly, Jr

Paul Goodwin

James G Wilder

David Roper

Julian Partridge

Ahmad Chamseddine

Douglas Wehrly

Amhad Chamseddine

Apparatuses, systems and methods for effective cooling of electronic devices are presented herein. More specifically, embodiments of the present invention comprise one or more heat pipes thermally coupled to electronic components and to a first heat sink and a second heat sink. The heat pipes are constructed to transfer heat generated at the one or more electronic components to the first heat sink and to the second heat sink. The first heat sink is operable to transfer heat energy to the ambient air using dissipation or advection. The second heat sink is able to transfer heat energy to the ambient air using dissipation. A controller is operable to switch between a passive mode of operation and an active mode of operation. The system can operate in a passive mode only in temperatures less than 25 degrees Celsius, can switch operation between a passive mode and an active mode without throttling in temperatures less than 60 degrees Celsius, can switch operation between a passive mode and an active mode in temperatures greater than 60 degrees Celsius while maintaining about 85% or greater maximum processing speed, and can operate in a passive only mode with minimal throttling.

System, apparatus and method for cooling electronic components

Cooling systems for computers are disclosed. In particular, embodiment of such cooling solutions may effectively be used in conjunction with mobile computers that have a polymer (or other type of) chassis. More specifically, embodiments of the present invention use micro vapor plates to conduct the heat generated by one or more electronic components of a mobile computer to the chassis of the mobile computer such that the heat from the electronic components is conducted into, and spread over, at least a portion of the surface of the chassis. The mobile computer can then be cooled by convection or radiation.

Flexible circuitry is populated with integrated circuitry (ICs), and contacts are distributed along the flexible circuitry to provide connection to an application environment. The flexible circuitry is disposed about a rigid substrate, placing the ICs on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate is preferably devised from thermally-conductive materials and one or more thermal spreaders are in thermal contact with at least some of the ICs. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.

Circuit module with thermal casing systems

Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

Heat sink for a high capacity thin module system

A flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of its major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. A rigid substrate is configured to provide space on one side where the populated flex is disposed while in some embodiments, heat management or cooling structures are arranged on one side of the module to mitigate thermal accumulation in the module.

Optimized mounting area circuit module system and method

Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. A rigid substrate configured with wings diverging from a central axis to create, preferably, a 'V'-shaped structure provide supportive structure for the populated flex circuitry that is wrapped about an edge of the substrate.

Split core circuit module

High capacity thin module system

Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. The populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally-conductive materials and one or more thermal spreaders are disposed in thermal contact with at least some of the constituent integrated circuitry of the module. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.

Growing community of inventors

Round Rock, TX, United States of America

Mark Wolfe