Other

Macdermid, Incorporated

Macdermid Acumen, Inc.

Mark Wojtaszek

Peter E Kukanskis

Gary B Larson

Robert M Hamilton

Ronald Redline

Gerald Wojcik

Jon E Bengston

Richard C Retallick

James Watkowski

Ying Ding

Massimo Dimarco

Robert Hamilton

The present invention relates to a method of selectively plating a plastic article comprising a first polymer resin portion and a second polymer resin portion, wherein said first polymer resin portion is not rendered plateable by sulfonation and said second polymer resin portion is rendered plateable by sulfonation. The method comprises the steps of sulfonating the plastic article, activating the sulfonated plastic article to accept plating thereon, and plating the sulfonated and activated article in an electroless plating bath. The plastic article is selectively plated such that the first polymer resin portion does not have plating thereon and the second polymer resin portion is electrolessly plated.

Selective deposition of metal on plastic substrates

The present invention is directed to an improved method for metallizing polymer substrates, such as polyimides. The present invention comprises the steps of surface treating the polymer substrate with a plasma jet or corona discharge surface treatment, conditioning and etching the polymer substrate with an etching solution comprising a hydroxide and ionic palladium, activating the polymer substrate with ionic palladium, reducing the palladium on the polymer substrate, plating an electroless nickel layer onto the prepared polymer substrate, and plating an electroless copper layer over the electroless nickel layer. The process of the invention provides an improved method for preparing the polymer substrate for subsequent electrolytic plating thereon.

Polyimide substrate and method of manufacturing printed wiring board using the same

The present invention sets forth an improved method of microetching a metal substrate by contacting the substrate with an aqueous composition comprising a sodium persulfate or hydrogen peroxide oxidizing agent, acid, and one or more additives. When the oxidizing agent is sodium persulfate, the one or more additives generally comprise an aliphatic saturated dicarboxylic acid. When the oxidizing agent is hydrogen peroxide, the one or more additives generally comprise a stabilizer and amino tris(methylene phosphonic acid).

Methods of cleaning copper surfaces in the manufacture of printed circuit boards

A conversion coating composition and a method of applying the conversion coating composition to magnesium and magnesium alloy articles prior to painting to prevent corrosion. The conversion coating composition comprises a source of vanadate ions, a material comprising phosphorus, and nitric acid or a source of nitrate ions. In addition, the composition may also contain boric acid or a source of borate ions and a source of fluoride ions or a source of fluoroborate ions.

Magnesium conversion coating composition and method of using same

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Canton, CT, United States of America

Mark Wojtaszek