Avery Dennison Corporation

Laird Technologies Gmbh

Mark Wisniewski

Jason L Strader

Ramabhadran Balaji

Richard L Sandt

Mark D Kittel

Karen Bruzda

Charles K Herrmann

Bernard S Mientus

Kushalkumar M Baid

Michael D Craig

Eng-Pi Chang

Ronald F Sieloff

Karen L Spilizewski

Reza Mehrabi

Wayne Louis Bilodeau

Kejian (Kevin) Huang

Philip Yi Zhi Chu

Hsiao Ken Chuang

Michael Lang

Robert O Bucholz

According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0001 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.

Thermal interface materials with thin film or metallization

A method of making a microneedle array structure () comprising a plurality of simultaneously formed microneedles (), each microneedle () having a protrusion () and a passageway () extending therethrough. The method comprises the steps of pressing an embossable sheet material between a complimentary tools and radiantly heating the sheet material using radiant energy from a radiant energy source. One tool is relatively-radiantly-transparent, and another tool and/or the sheet material is relatively-radiantly-absorptive.

Method of making microneedles

According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a metallization layer having a layer thickness of about 0.0005 inches or less. The metallization layer is disposed along at least a portion of the first side of the thermal interface material.

Thermal interface material with thin transfer film or metallization

According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0005 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.

This invention relates to an in-mold label comprising a core layer with a first and second surface and a heat seal layer on the first surface of the core layer, wherein the heat seal layer comprises a polyolefin, having a peak melt temperature of less than about 110&#xb0; C. and where less than about 25% of the polyolefin melts at a temperature of less than 50&#xb0; C. as measured by differential scanning calorimetry. The label may also contain a skin layer on the second surface of the core layer. The invention also relates to plastic substrates bonded to the label. In another aspect, the present invention also relates to a process for in-mold labeling and a process for preparing an in-mold label. The labels and processes provide reduced amounts of one or more of the following: blisters, both before and after bonding, shrinkage, bagginess and gage bands.

In-mold labels and users thereof

This invention relates to a multilayered thermoplastic film comprising: a thermoplastic core layer having a first side and a second side, the core layer comprising: a polyolefin having a density in the range of about 0.89 to about 0.97 grams per cubic centimeter; a second polymeric material selected from ionomers derived from sodium, lithium or zinc and an ethylene/methacrylic acid copolymer, and a combination thereof, and a light stabilizer; an abrasion and scuff resistant clear first thermoplastic skin layer overlying the first side of the core layer, and a clear second thermoplastic skin layer overlying the second side of the core layer, both skins containing light stabilizer. The composition of the core layer is different from the composition of the skin layers, and the core layer and the skin layers are characterized by the absence of PVC.

Multilayered thermoplastic film and sign cutting method using the same

In-mold labels and uses thereof

This invention relates to a thermal transfer laminate, comprising: a facestock comprising a first layer having an upper surface and a lower surface, and a heat-activatable adhesive layer underlying the lower surface of said first layer; an adhesion-promoting layer overlying the upper surface of said first layer; an abrasion-resistant transparent coating layer overlying said adhesion-promoting layer; and another adhesive layer overlying said abrasion-resistant coating layer. In one embodiment, an ink or graphics layer overlies the upper surface of the first layer of the facestock and provides a pictorial design and/or print message. In one embodiment, the laminate is adhered to a carrier sheet. In one embodiment, the laminate is adhered to a substrate such as an automotive interior surface.

Thermal transfer laminate

This invention relates to an imaged receptor laminate, comprising: a thermoplastic core layer having a first side and a second side; a thermoplastic skin layer overlying said first side of said core layer, said skin layer comprising a major amount of a thermoplastic copolymer or terpolymer derived from ethylene or propylene and a functional monomer selected from the group consisting of alkyl acrylate, acrylic acid, alkyl acrylic acid, vinyl acetate and combinations of two or more thereof, said skin layer having a melting point in the range of about 50.degree. C. to about 120.degree. C., said core layer having a melting point that is higher than the melting point of said skin layer; and an electrostatically formed and developed image adhered to said skin layer. In one embodiment, a dielectric layer overlies the toned image and the skin layer. In one embodiment, a conductive carrier sheet overlies the foregoing dielectric layer. In one embodiment, an overlaminate protective film layer overlies the image and the skin layer. In one embodiment, an overlaminate protective film layer overlies the dielectric layer. This invention also relates to a process for making the foregoing imaged receptor laminate.

Growing community of inventors

Mentor, OH, United States of America

Mark Wisniewski