Hewlett-packard Development Company, L.p.

3m Innovative Properties Company

Mark Walsh

John Oliver

Jefferson Patrick Ward

Iain Campbell-Brown

Amy Shipman

Brendan Hall

Aidan O'Reilly

Tommy O'Connor

Garry Rooney

Stephen Byrne

Willie Sheehan

Michael Dineen

Ronald L Imken

Alejandro Aldrin A Narag, Ii

Lynn Walsh

Soon Yeng Chan

Example circuits and methods are described involving a flexible substrate for a fluid cartridge, comprising an integrated circuit connected to the flexible substrate, and electrical connector pads arranged on the flexible substrate for connection to the integrated circuit.

Flexible substrate with integrated circuit

In one example, a flexible circuit for a fluid cartridge includes a single flexible substrate, an integrated circuit connected to the single flexible substrate, and an electrical connector pad array arranged in a constant pattern on the single flexible substrate for connection to a host controller. The electrical connector pad array includes first electrical connector pads connected to the integrated circuit and second electrical connector pads for connection to a fluid dispensing die.

In one example a replaceable tri-color ink cartridge housing includes three chambers for different colors ink. In a further example, a headland may have three parallel ink slots having a length of at least 14.4 millimeters.

Tri-color ink cartridge housing

A replaceable tri-color ink cartridge, comprising three chambers for different colors ink; a headland having headland slots each fluidically connected to a respective chamber; and a printhead die attached to the headland, the die including (i) nozzle arrays having a length of at least 14.3 millimeters, and (ii) feed slots that fluidically connect the headland slots to the respective nozzle arrays, wherein each headland slot is longer than the corresponding feed slot.

Tri-color ink cartridge

In one example, a flexible circuit for a fluid cartridge includes a single flexible substrate, an electronic memory on the substrate, an authentication code stored on the memory, first electrical connector pads on the substrate connected to the memory, and second electrical connector pads on the substrate, not connected to the memory, to connect to a fluid dispensing die.

A circuit can include a die configured to electronically control particular elements and a flex circuit having copper leads coated with a non-gold corrosion inhibitor, the flex circuit being electrically connected to the die by the copper leads.

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Dublin, Ireland

Mark Walsh