Honeywell International Inc.

Mark W Watson

Robert B Anderson

Dean R Hellickson

Michael A Gilbert

Chad E Richason

Allen F Tuthill

Systems and methods for passive thermal management using phase change material are provided. In one embodiment, a thermal management method is provided. The method comprises securing an electronics assembly to a mounting surface using a thermally insulative support structure; insulating a phase change material within the support structure; and melting the phase change material to reduce heat transfer from an external environment to the electronics assembly during a high temperature transient thermal condition.

Systems and methods for passive thermal management using phase change material

An apparatus for electrically shielding electronic components is provided. The apparatus includes a circuit board having a first surface with a plurality of electronic components mounted on the first surface, the first surface having a first region and a second region. The circuit board comprises a ground plane and a trace on the first surface coupled to at least one electronic component in the first region and coupled to at least one electronic component in the second region. The circuit board also comprising a strip of conductive material on the first surface, the strip of conductive material forming a perimeter around the first region of the circuit board, the strip of conductive material coupled to the ground plane, the strip of conductive material defining at least one gap wherein the trace is oriented through the at least one gap. Additionally, a first filtering device is coupled to the trace on a first side of the gap. The apparatus also includes a cover composed of a conductive material for the first region of the circuit board. The cover comprises a contact surface configured to contact the strip of conductive material on the circuit board. The contact surface has at least one notch. The at least one gap of the circuit board is configured to align with the at least one notch of the cover when the cover is installed on the circuit board.

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New Port Richey, FL, United States of America

Mark W Watson