USA As Represented by Secretary of the Navy

Mark W Sewell

Michael M Canaday

Timothy L Spivak

Perry L Fridley, Jr

A mission responsive ordnance includes projectiles arranged in a bundled configuration that defines a substantially solid structure with each of the projectiles forming a geometric portion thereof. In a unitary mode of operation, the bundled configuration is maintained to define an integral structural element that bears loads generated when the bundled configuration strikes and penetrates a target. In a sub-divided mode of operation, the projectiles are un-bundled before a target is struck so that the projectiles are released into a surrounding environment.

Mission responsive ordnance

A mission responsive ordnance of the present invention arranges a plurality of projectiles in a bundled configuration. The bundled configuration is defined by the projectiles and a bundling means which, together, form a combination that bears loads generated when the bundled configuration strikes and penetrates a target. Unbundling means, coupled to the bundling means, can be operated to selectively render the bundling means inoperative before the target is struck so that one or more of the projectiles are released from their bundled configuration.

A device for dissipating heat from cased electronics where optimum heat tsfer is required, and where easy removability is desired. The device finds utility in sonobuoys, buoys, missiles and mines, as well as cabling electronics such as transoceanic communications equipment. The device contains a translating wedge which is drawn into a forced fit between the heat generating module and a conducting wedge which contacts the electronics case, resulting in a high efficiency conducting thermal path from the electronics to the equipment case. The device is particularly efficate in circular cased electronics.

Translating wedge heat sink

A device for dissipating heat from electronics encased in a circular hous is disclosed for uses in buoys, sonobuoys, mines and missiles. The device contains a heat dissipating ring that engages the inner surface of the cylindrical electronics case. The inside surface of this ring is tapered to receive a heat transfer disk that is pulled into tight union with the heat dissipating ring. A heat generating module is mounted in heat transfer union with the disk whereby excess heat is transferred from the disk through the ring to the electronics case where it is dissipated into the environment.

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King George, VA, United States of America

Mark W Sewell