Airgard, Inc.

Mattson Technology, Inc

Other

Mark W Johnsgard

Kris Johnsgard

Daniel L Messineo

Robert T LoBianco

Kristian E Johnsgard

James McDiarmid

Robert D Mailho

Steven E Parks

David E Sallows

Husain Lohawala

Robert T Lobianco

A heated inlet tube for use in a wet scrubber is disclosed. In one embodiment, the heated inlet tube comprises a heated tube concentric to the inlet tube to which a heated gas is applied thereby maintaining temperature of a waste gas stream as it flows through the inlet tube. In a further embodiment, an insulating tube concentrically surrounds the heated tube to further maintain the temperature of the waste gas stream.

Concentrically heated inlet tube for gas scrubbing apparatus

An improved electrode for use in an electrostatic precipitator is disclosed. The electrode comprises a generally rod-shaped conductive central portion, to which are attached a plurality of conductive disc-shaped elements. Each disc-shaped element has a number of sharp points spaced around its circumference and a plurality of openings near its center. The central portion of the central portion passes through the centers of each of the plurality of disc-shaped elements such that the disc-shaped elements are located parallel to one another along the central portion, and may be equally spaced along the central portion. The disc-shaped elements are conical or convex in shape, and oriented with their rims raised above their centers so that any water that collects on them runs out through the openings and down the central portion of the electrode. This greatly reduces or eliminates arcing between the electrode and a collector in the electrostatic precipitator.

Electrode for electrostatic precipitator gas scrubbing apparatus

Abatement systems are used to remove harmful pollutants resulting from manufacturing processes. Prior art abatement systems can dangerously back-flash due to, for example, changes in gas velocity and if the inlets become constricted due to clogs. To prevent back-flash a sprayer is introduced to an inlet of the abatement system. The sprayer sprays a volume of a cooling liquid, such as water, into the inlet. In the event of a back-flash, the liquid can extinguish the flame, preventing further damage to the abatement system. The sprayed liquid can provide further benefits, such as cooling the incoming, mitigating effects of reactions within the cooling gases, and flushing away solid particles that would otherwise clog the inlet. These further benefits can allow the abatement system to safely handle additional gases and larger volumes of incoming gas.

Systems and methods to prevent back-flash in an abatement system

Some industrial or fabrication processes generate effluent gas streams that require scrubbing. Scrubbing may include the use of one or more gases to abate the effluents for safer release into the environment. Systems and methods described herein provide a liquid-enclosed reaction chamber where an extended reaction zone or more than one reaction zone is formed. By having an extended reaction zone or more than one reaction zone, the effluent gas stream and the products of upstream reaction zones can be more completely abated. The reaction zones are formed by adding one or more gas ports into the reaction chamber downstream of a main burner nozzle.

Extended or multiple reaction zones in scrubbing apparatus

Various apparatus provide for spraying high velocity droplets of liquid into a low velocity gas stream. Finely atomized droplets may quickly transfer their momentum to the gas, resulting in deceleration of the spray and acceleration of the gas. A high velocity spray of atomized liquid may transfer a substantial fraction of its kinetic energy to the gas before contacting a surface, in some aspects, suspended particles in the gas phase may be removed by high velocity liquid droplets passing through the gas. Certain aspects provide for controlling a gas flow by controlling the relative amounts of upstream and downstream momenta transferred to the gas by one or more liquid sprays.

Momentum transfer using liquid injection

Aspects include a valve comprising a flowing liquid, operable to control a flow of gas through a port. Certain aspects include reaction chambers operable to react gases, and in some aspects gases are substantially contained within an envelope comprised of a flowing liquid. Certain embodiments control gas entrance into a chamber with a valve comprised of a flowing liquid controlling gas flow through a port. Various gas scrubbing systems are described, including systems comprising reaction chambers operable to react gases that yield substantial amounts of solid reaction products. Methods for controlling gas flow are disclosed. Systems and methods include sequential steps of wet-scrubbing, reacting and further wet-scrubbing a gas stream.

Reactive gas control

A low-maintenance scrubber inlet device is provided for delivering effluent gases to gas scrubbers. The scrubber inlet device may comprise an interior volume configured to receive effluent gases and direct the effluent gases into the scrubber while maintaining the temperature of the effluent gases. In some instances, a heated gas is introduced to maintain the effluent gas temperature. The scrubber interface device is configured to deliver the effluent gas stream from the inlet manifold to the gas scrubbing system, and to have a very low susceptibility to clogging.

Apparatus and method for providing heated effluent gases to a scrubber

An effluent gas scrubber and a method of scrubbing effluent gases are provided. An inlet port receives an effluent gas. The gas passes through successive chambers in which it is sprayed with a scrubbing fluid. An oxidizer within the scrubbing fluid is effective to oxidize non-water soluble gases within the effluent gas. An oxidation-reduction potential probe measures the oxidation-reduction potential of the scrubbing fluid and adds the oxidizer to the scrubbing fluid as needed. A pH probe measures the pH of the scrubbing fluid and adds a base to the scrubbing fluid as needed to maintain the pH at or above a threshold such as pH 7, or pH 12.

Effluent gas scrubbing

A low-maintenance scrubber inlet device is provided for delivering effluent gases to gas scrubbers. The scrubber inlet device comprises a scrubber interface device in fluid communication with an inlet manifold. The inlet manifold is configured to receive effluent gases and direct the effluent gases into the scrubber interface device while maintaining the temperature of the effluent gases. In some instances, a heated gas is introduced into the inlet manifold to maintain the effluent gas temperature. The scrubber interface device is configured to deliver the effluent gas stream from the inlet manifold to the gas scrubbing system, and to have a very low susceptibility to clogging.

Effluent gas scrubber and method of scrubbing effluent gasses

Systems and methods for epitaxial deposition. The reactor includes a hot wall process cavity enclosed by a heater system, a thermal insulation system, and chamber walls. The walls of the process cavity may comprises a material having a substantially similar coefficient thermal expansion as the semiconductor substrate, such as quartz and silicon carbide, and may include an isothermal or near isothermal cavity that may be heated to temperatures as high as 1200 degrees C. Process gases may be injected through a plurality of ports, and are capable of achieving a fine level of distribution control of the gas components, including the film source gas, dopant source gas, and carrier gas. The gas supply system includes additional methods of delivering gas to the process cavity, such as through temperature measurement devices, and through a showerhead.

Systems and methods for epitaxially depositing films on a semiconductor substrate

A thermal processing system and method for processing a semiconductor substrate. A lamp system radiates through a window to heat the substrate. A dual gas manifold provides purge gas through a top showerhead to prevent deposits on the window and provides gas through a lower showerhead to deposit a material on the substrate. A thin support and a radiative cavity with thin radiation shields is used to support and insulate the substrate. A peripheral heater also heats the edges to enhance uniformity. An opaque quartz liner is used to reduce contaminants and undesired deposits and simplify cleaning.

Apparatus and method for CVD and thermal processing of semiconductor substrates

An effluent gas scrubbing system is disclosed having an improved scrubber inlet system including a transition tube having a fluted lower portion for directing particulate carrying gas into the mist saturated scrubbing chamber of a gas scrubber, a fluid reservoir affixed to the upper portion of the transition tube and having a plurality of fluid supply jets tangentially positioned along internal cavity forming walls of the reservoir so as to cause the fluid within the internal cavity of the reservoir to swirl, and a readily interchangeable gas inlet pipe which is co-axially positioned within the cavity and with respect to the transition tube so as to create a transition gap between the transition tube and the inlet pipe through which a swirling flow of fluid may exit the cavity and enter the upper portion of the transition tube so as to thoroughly coat the entire length of the transition tube with fluid, and so as to provide a smooth and abrupt transition between the dry-walled inlet pipe and the wet-walled transition tube.

Growing community of inventors

San Jose, CA, United States of America

Mark W Johnsgard