International Business Machines Corporation

Other

Usm Corporation

Waddington North America, Inc.

Mark Vincent Pierson

Michael A Gaynes

Ramesh R Kodnani

Cynthia Susan Milkovich

Jerzy Maria Zalesinski

Ajit Kumar Trivedi

Charles Gerard Woychik

Thurston Bryce Youngs, Jr

Christian Robert Le Coz

Voya Rista Markovich

Wayne John Howell

Miguel Angel Jimarez

William E Bernier

Amit Kumar Sarkhel

Anthony P Ingraham

John Gillette Davis

Lawrence Richard Cutting

Michael D Lowell

Alan Harris Crudo

Frank Daniel Egitto

David Brian Stone

Eric A Johnson

Luis Jesus Matienzo

Lisa Jeanine Jimarez

Gary Ray Hill

Kibby B Horsford

Allan O Johnson

Gordon C Osborne, Jr

Jeffrey S Perkins

Edward J Tasillo

Lawrence E Williams

Lewis C Hecht

Merritt P Sulger, Deceased

Ernst E Thiele

Richard Gordon Charlton

Mark Andrew Couture

Claude Louis Bertin

William R Tonti

Eugen Schenfeld

William John Rudik

Karl J Puttlitz, Sr

George Charles Correia

Thomas M Culnane

Craig G Heim

Russell H Lewis

Anthony D'Amelia

George D Oxx

Steven E Poetzinger

John Ulrich Knickerbocker

Wayne Frederick Ellis

Robert Maynard Japp

How Tzu Lin

Subhash Laxman Shinde

Natalie Barbara Feilchenfeld

Kenneth Michael Fallon

David L Thomas

Dinesh Gupta

William T Chen

Brenda Lee Peterson

Stephen Joseph Fuerniss

Francis Joseph Downes, Jr

Gregg J Armezzani

Joseph Angelo Benenati

Aleksander Zubelewicz

Thomas E Dinan

Donald I Mead

Raymond A Phillips, Jr

Robert Nicholas Ives

Jennifer Rebecca Sweterlitsch

Terry Alan Tull

Pat Hoontrakul

Terry J Dornbos

Erik L Hedberg

Anilkumar Chinuprasad Bhatt

Steven Paul Ostrander

Howard Victor Mahaney, Jr

Bahgat Ghaleb Sammakia

Son K Tran

Monty Montague Denneau

Paul A Totta

Thomas P Duffy

Stanley R Vancelette

Morris Anschel

John Thomas Legg

Michael S Foley

Timothy Shawn Reny

Scott D Reynolds

Nikhil Mohan Murdeshwar

Mark J Levy

Wayne R Storr

Richard Gerald Murphy

Charles Robert Lamb

Joseph J Van Horn

Robert D DiNozzi

Jeffrey C Baechtle

Steven F Arndt

Wolfgang Mayr

Steven Eugene Poetzinger

Anne M Quinn, Deceased

By Ellen Sulgar, Executrix

Recyclable and dispensable hygienic cutlery utensil. A preferred embodiment of the present invention includes a handle portion and head portion. The handle portion provides suitable area for gripping and includes a chamfer on its outer edge for facilitating a predictable release from a utensil dispenser. The head portion is formed into the shape of a common cutlery utensil such as: knife with large radius, tapered knife with large radius, spoon, set of tines (fork), and spoon-fork combination, to name a few. The head portion also includes an escapement feature in its outer edge for facilitating controlled release from the bottom of a stack of utensils. The escapement feature can include a notch or predetermined release radius. Typically in use, a set of utensils is stacked, forming a cartridge which is then inserted into an automated dispensing system.

Recyclable and dispensable cutlery utensil

A device for dispensing cutlery utensils individually, having a housing containing a quantity of utensils with the housing having sides and product guides within. The front wall contains an opposing leaf escapement mechanism connected to it, to hold and singulate the utensils such that they dispense seriatim, without a user being required to physically touch or interface with any part of dispenser other than the actual desired utensil.

No touch utensil dispenser

A toothpaste dispenser having an upper chamber and an inlet port connected for receiving toothpaste and a lower chamber and an outlet port connected for dispensing toothpaste. Suction is created to draw toothpaste into the inlet port, and then forced through the outlet port during actuation. Initiating operation of the suction pulls toothpaste into an upper chamber, and a plunger for expelling the toothpaste from the chamber is operatively connected to the outflow ball check valve for intermittently blocking the flow of toothpaste into and from the toothpaste dispenser. The toothpaste dispenser utilizes ball check valves and two return springs operatively connected to the ball check valves. The toothpaste dispenser actuation has a plunger and also has a portion size adjustment device connected to the plunger for modifying the amount of toothpaste dispensed from the toothpaste dispenser.

Toothpaste dispenser

Optical cubes and optical cube assemblies for directing optical beams are provided. The optical cubes are optically transparent modules that can be adapted to reflect, transmit, and/or partially reflect and transmit optical beams. The optical cubes may include bi-direction or multi-direction beam directing elements for directing optical beams. The optical cube assemblies may include flexible chip assemblies attached to optical cubes. The chip assemblies may include vertical cavity surface-emitting lasers for emitting optical beams or receivers for receiving optical beams mounted on a flexible and electrical interconnect mounting assembly.

Optical assemblies for transmitting and manipulating optical beams

The current invention provides a method of attaching a plurality of cores wherein a core has a via with a conductive surface to be electrically connected to a conductive surface on another core. The method provides for applying a metallurgical paste to a conductive surface, removing a portion of the flux from the paste and joining the two cores. The current invention also provides a structure including a plurality of cores wherein a metallurgical paste electrically connects a via with a conductive surface on a core to a conductive surface on another core.

Z interconnect structure and method

The present invention to be personalized is fitted with a sealed chamber. The chamber is defined by an object and a thin, flexible member. When it is desired to personalize the object, the sealed chamber is filled with uncured paste having predetermined characteristics. The object to be personalized then is brought into contact with a human; thereafter, the paste cures in place to complete the personalizing process.

Formable structure between two objects

Under the present invention, a contaminant capturing material is positioned within a disk drive. Specifically, the contaminant capturing material is positioned on a suspension, adjacent a slider that hovers proximate a disk within the disk drive when the disk is in rotation. The contaminant capturing material will prevent contaminants from contacting the disk and thereby causing damage. In addition, a set of porous, open celled filters that are coated with the contaminant capturing material can also be provided. If used, the open celled filters are positioned adjacent the disk within an air stream created by a rotation of the disk.

System and method for capturing contaminants within a disk drive

An electrical structure, and associated method of fabrication, for reducing thermally induced strain in a structure that couples a first conductive body of a first substrate to a second conductive body of a second substrate (e.g., a chip to a chip carrier; a chip carrier to a circuit card). The melting point of the first conductive body exceeds the melting point of the second conductive body. The second conductive body may include eutectic lead-tin alloy, while the first conductive body may include non-eutectic lead-tin alloy. A portion of the first conductive body is coated with, or volumetrically surrounded by, a material that is nonsolderable and nonconductive. The first and second conductive bodies are coupled mechanically and electrically by surface adhesion at an uncoated portion of the first conductive body, by application of a temperature that lies between the melting points of the first and second conductive bodies.

Flip chip C4 extension structure and process

A flexible, compliant layer of a single low modulus material for connecting a chip die directly to a circuit card without encapsulation. The flexible compliant layer provides stress relief caused by CTE thermal mismatch in chip die and circuit card. An array of copper plated vias are formed in said compliant layer with each via terminating on opposing surfaces of the layer in copper pads. Rather than copper, other metals, such as gold or nickel, may also be used. An array of holes may be positioned between said array of vias to provide additional resiliency. The plated vias may be angled with respect to said opposing surfaces to allow additional vertical and horizontal stress relief. Connection of the pads on one surface to high melt C-4 solder balls or columns on a chip die results in solder filled vias. Low melt solder connection of the pads on the other surface to a circuit card allows non-destructive rework of the cards.

Methods of making and using a floating interposer

An optical assembly comprising an optical cube. A first optical transmitter chip and a first optical receiver chip are mounted on one surface of the optical cube. A first continuous printed circuit board is soldered to electrical surfaces of the first optical transmitter chip and the first optical receiver chip opposite the optical cube. A second optical transmitter chip and a second optical receiver chip are mounted on an opposite surface of the optical cube. A second continuous printed circuit board is soldered to electrical surfaces of the second optical transmitter chip and the second optical receiver chip opposite the optical cube. The first optical transmitter chip is optically aligned with the second optical receiver chip through the optical cube. The second optical transmitter chip is optically aligned with the first optical receiver chip through the optical cube. The first and second printed circuit boards may be bent ninety degrees and soldered to another printed circuit board, or connected to an edge connector on another printed circuit board.

Optical communication assembly

An attachment structure, and an associated method and system for forming the attachment structure. An end of an optical fiber is melted while the end is above, but not touching, an exposed surface of a substrate such that said end becomes molten. The optical fiber is substantially optically transparent to laser radiation of a given wavelength. The molten end is moved toward the exposed surface of the substrate until the end makes physical contact with the exposed surface of the substrate. The moving is performed sufficiently fast so that the end is still molten when the end initially makes the physical contact with the exposed surface of the substrate. The physical contact is maintained for a sufficient length of time to enable the end to bond to the exposed surface of the substrate with no intervening matter between the end and the exposed surface of the substrate.

Fiber optic attachment method, structure, and system

Floating interposer

Growing community of inventors

Binghamton, NY, United States of America

Mark Vincent Pierson