Other

Cisco Technology, Inc.

Bonutti Ip, LLC

Mark V Brillhart

Peter M Bonutti

Georgios Margaritis

Surgical devices such as implants or suture fastenings are assembled from a plurality of discrete components, one of which components includes a heat bondable plastic material for bonding the components together. At least two components are bonded to each other by the applying heat to the heat bondable plastic material of one component. The heat bondable plastic material is preferably a polymeric or composite material suitable for surgical applications and implantation in humans, and may be a biodegradable material. A laser may be used as the heat source. The present invention is advantageously embodied in heat bonded fastenings for sutures or K-wires, in which a variety of different suture anchors are usable, including expandable distal suture anchors. Other embodiments include a metal bone plate which is held to bone by a metal bone screw and a nut of bondable material bonded to the plate to secure the connection; a piece of bondable material bonded to a metal prosthesis to custom fit the prosthesis; and a surgical implant custom formed by bonding together a plurality of discrete elements one or more of which is bondable.

Surgical devices having a polymeric material with a therapeutic agent and methods for making same

Surgical devices having a biodegradable material with a therapeutic agent

Surgical devices assembled using heat bondable materials

A multi-chip, module (MCM) having one or more high value chips such as ASICs, CPUs, DSPs or the like attached to the MCM substrate via a direct attach technology (such as flip chip) and one or more memory chips attached to the MCM substrate via a reworkable technology such as connector and receptacle-based package, wirebond package, chip scale package (CSP), leaded package, ball grid array package, or fine pitch ball grid array package. The MCM substrate may, in turn, be attached to a motherboard via solder balls (ball grid array); leads and/or connector interconnect technologies (such as compression sockets).

Flip chip and packaged memory module

A method and apparatus for assembly of a printed circuit board (PCB) having surface mount technology (SMT) components and an optics device utilizes a compressive connector to clamp the optics device to the printed circuit board and resist side loads. A metallized particle interconnect or equivalent array interfaces a land grid array on the optics device with a land grid array on the PCB. The connector passes through the PCB and through a hole in an integrated heat sink of the optics device. A pair of optics devices may thus be mounted to opposing sides of the PCB in tandem. Fiber optic cables may be attached to the optics devices so that they lead out of the optics devices parallel to the PCB.

Solderless optical transceiver interconnect

Interconnecting bone across a fracture

A portable computer comprising a main computer body with an embedded keyboard, and a display unit. The computer body is electrically connected with the display unit and the display includes a controllably collapsible and erectable display unit support for adjusting the position of the display unit with respect to the main computer body, whereby the display unit can be positioned at a comfortable and ergonomically safe position and the portable computer including the support can be folded compactly for storage or transportation. In another embodiment, the display unit is detachable from the main computer body, and is suspended by an external structurally stable object by suspension, whereby the display unit can be positioned at a comfortable and ergonomically safe position and no support needs to be transported or stored with the computer, thereby saving weight and space.

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Effingham, IL, United States of America

Mark V Brillhart