University of Illinois

Wisconsin Alumni Research Foundation

X-celeprint Limited

Semprius, Inc.

Northwestern University

Mark Stoykovich

John A Rogers

Heung Cho Ko

Matthew Alexander Meitl

Etienne Menard

Ralph G Nuzzo

Yugang Sun

Alfred J Baca

Jongseung Yoon

Jong-Hyun Ahn

Michael Motala

Chang-Jae Yu

Yonggang Huang

Won Mook Choi

Sang-Il Park

Paul Franklin Nealey

Juan Jose De Pablo

Jong Hyun Ahn

Marcus Muller

Konstantinos C Daoulas

Dahl-Young Khang

Zhengtao Zhu

Hanqing Jiang

Andrew Evert Carlson

Jizhou Song

Dae Hyeong Kim

SangMin Park

Huiman Kang

Keon Jae Lee

Hoon-sik Kim

Erik W Edwards

Seong Jun Kang

Heung-Cho Ko

SangOuk Kim

Sang-II Park

Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.

Optical systems fabricated by printing-based assembly

In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics

Disclosed herein are stretchable, foldable and optionally printable, processes for making devices and devices such as semiconductors, electronic circuits and components thereof that are capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Strain isolation layers provide good strain isolation to functional device layers. Multilayer devices are constructed to position a neutral mechanical surface coincident or proximate to a functional layer having a material that is susceptible to strain-induced failure. Neutral mechanical surfaces are positioned by one or more layers having a property that is spatially inhomogeneous, such as by patterning any of the layers of the multilayer device.

Stretchable and foldable electronic devices

Methods of fabricating complex three-dimensional structures on patterned substrates and related compositions are provided. The methods involve depositing on the substrate a block copolymer material that is 'mismatched' to the substrate pattern, and then ordering the material to form a complex three-dimensional structure. According to various embodiments, the copolymer material mismatches the substrate pattern in that the symmetry and/or length scale of its bulk morphology differs from that of the pattern. When ordered, a balance between the physics that determines the bulk block copolymer morphology and the physics that determines the substrate surface interfacial interactions results in a thermodynamically stable complex three-dimensional film that varies in a direction perpendicular to the substrate and has a morphology that differs from its bulk morphology.

Fabrication of complex three-dimensional structures based on directed assembly of self-assembling materials on activated two-dimensional templates

Growing community of inventors

Dover, NH, United States of America

Mark Stoykovich