Advanced Micro Devices Corporation

Mark Steinke

Gamal Refai-ahmed

Paul Theodore Artman

Suresh Ramalingam

Chi-Yi Chao

Md Malekkul Islam

A heat exchanger for a chip package is provided. The heat exchanger includes a body having an upper side, a lower side, and an internal cavity disposed in the body between the upper side and the lower side. A first outlet port and a second outlet port are formed in the body and are in fluid communication with the internal cavity. An inlet port is formed through the upper side of the body between the first and second outlet ports to supply fluid into the internal cavity.

Thermal management system for electronic device

Disclosed herein are electronic devices that utilized a thermal bus disposed on a backside of a printed circuit board (PCB) to route heat efficiently to a thermal management device disposed on the front side of the PCB, thus enhancing thermal regulation of integrated circuit (IC) devices mounted on the backside of the PCB.

Growing community of inventors

Austin, TX, United States of America

Mark Steinke