International Rectifier Corporation

Mark Steers

Peter R Ewer

George Pearson

Alberto Guerra

Arthur Woodworth

Norman Glyn Connah

Kevin Smith

Alex Kamara

A substrate, which has semiconductor die arranged thereon, uses at least one solder flow stop, closely surrounding at least a portion of at least one mounting pad on which the die are mounted, to prevent die rotation during solder reflow. The at least one solder stop is non-wetting, during a solder reflow process, to solder used to mount the die.

Solder flow stops for semiconductor die substrates

A power module that includes a power circuit assembly in which power components are electrically and mechanically connected without wires.

Power module

A semiconductor device package is provided which can accommodate currents larger than those of similarly sized standard device packages such as the &ldquo;TO-247&rdquo; package. Higher currents are accommodated by allowing a larger semiconductor die to be mounted on the device's lead frame than can be mounted on a similarly sized standard package. An improved mold clamping area is also provided which reduces the area from which damaging moisture can enter the molded package and increases the distance required for moisture to contact the die. Clip arrangements are also provided to mount the device package to a circuit board or heat sink, thereby allowing the increased operating temperatures associated with the increased operating currents to be efficiently dissipated. The semiconductor device package has a lead frame having a large area paddle section and at least one leg extending therefrom, the lead frame being of substantially constant thickness, and the paddle section being continuous and free of openings therethrough. A semiconductor die is mounted to the paddle section of the lead frame, the semiconductor die occupying substantially all of the surface area of a side of the paddle section upon which the semiconductor die is mounted. The full surface of the die and at least the side of the paddle section upon which the semiconductor die is mounted are covered by a common and uninterrupted mold housing.

High current capacity semiconductor device housing

A surface mount semiconductor package includes a semiconductor device, a metal pad on which the semiconductor device is mounted, and a housing formed of a flowable material which bonds to the metal pad and encapsulates the semiconductor device when cured, where the metal pad includes a waffled surface opposite the surface on which the semiconductor device is mounted for accepting solder between the metal pad and a substrate and for permitting solder wetting therebetween.

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West Sussex, United Kingdom

Mark Steers