Juniper Networks, Inc.

Hewlett-packard Development Company, L.p.

Mark Simpson

Boris Reynov

Shreeram Siddhaye

Oscar Diaz-Landa

Chebrolu S Srinivas

Mark Devenport

Lee M Forbes

Srinivas Venkataraman

William Oberlin

Joyce Kitabayashi

Bipin Dhavale

The disclosed apparatus may include (1) a plurality of SerDes devices that each facilitate transmitting and receiving communications in connection with a network device and (2) at least one phase-adjustment device communicatively coupled to a first SerDes device included in the SerDes devices, wherein the phase-adjustment device mitigates crosstalk among the SerDes devices by (A) receiving at least one reference clock signal, (B) generating at least one phase-adjusted clock signal based at least in part on the reference clock signal such that the phase-adjusted clock signal and the reference clock signal are out of phase with respect to one another, and (C) delivering the phase-adjusted clock signal to the first SerDes device to ensure that the SerDes devices are switching out of phase with respect to one another. Various other apparatuses, systems and methods are also disclosed.

Apparatus, system, and method for mitigating crosstalk among SerDes devices

A printed circuit board (PCB) defines a first outer surface and a second outer surface that is opposite the first outer surface. The first outer surface of the PCB defines a recess. The PCB includes a signal layer between the first outer surface and the second surface with a first portion exposed within the recess and a second portion exposed within the recess. A component is disposed within the recess and connected to the first portion and the second portion of the signal layer such that an entirety of the component is within the recess and below the first surface.

Apparatus and methods for placement of discrete components on internal printed circuit board layers

A printed circuit board (PCB) may include antipads, used to provide clearance for backdrilling, which may be sized to allow backdrilling in a way that minimizes the presence of stubs. The PCB may include pads to connect a component to the PCB and vertically disposed vias connected to at least some of the pads. The PCB may further include horizontally disposed signal layers, electrically connected by the vias, to route signals from the component, received from the vias, to an edge of the component, in which signals associated with the component closer to an inner portion of the component are routed to the edge of the component on higher ones of the signal layers than signals associated with the component further from the inner portion of the component.

Selective antipad backdrilling for printed circuit boards

Memory systems and methods are described. In one embodiment, a circuit board has front and back surfaces. At least one memory device having a plurality of pins is mounted on the front surface of the circuit board. At least one other memory device having a plurality of pins is mounted on the back surface of the circuit board. The memory devices are mounted on the circuit board such that at least some pins from the one memory device align with at least some pins of the other memory device to provide aligned pin pairs. A via is disposed in the circuit board and extends between and connects individual pins of an aligned pin pair.

Memory systems and methods

Growing community of inventors

Cupertino, CA, United States of America

Mark Simpson