Rohm & Haas Electronic Materials LLC

Mark Scalisi

Matthew A Thorseth

Zuhra I Niazimbetova

Joanna Dziewiszek

Rebecca Lea Hazebrouck

Mark Lefebvre

Ravi Pokhrel

Luis A Gomez

Corey Ciullo

Bryan Lieb

James Byrnes

Rebecca Hazebrouck

Copper electroplating baths containing primary alcohol alkoxylate block copolymers and ethylene oxide/propylene oxide random copolymers having specific HLB ranges are suitable for filling vias with copper, where such copper deposits are substantially void-free and substantially free of surface defects.

Method of electroplating copper into a via on a substrate from an acid copper electroplating bath

Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyrazole compounds and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyrazole compounds and bisepoxides

Copper electroplating baths and methods enable the plating of photoresist defined megafeatures at high current densities which have substantially uniform morphology and reduced nodule development. The copper electroplating baths include a mixture of heterocyclic nitrogen containing copolymers which provide megafeatures having a good % TIR and % WID balance.

Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features

Copper electroplating baths having a surface tension of &#x2266;40 mN/m are suitable for filling vias with copper, where such copper deposits are substantially void-free and substantially free of surface defects.

Plating method

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Mark Scalisi