Rohm & Haas Electronic Materials LLC

Dow Global Technolgoies LLC

Ddp Specialty Electronic Materials Us, LLC

Mark S Oliver

Michael K Gallagher

Karen R Brantl

Zhifeng Bai

Christopher John Tucker

Zidong Wang

Elissei Iagodkine

Matthew T Bishop

Elissei Lagodkine

Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.

Ephemeral bonding

Compositions containing an adhesive material and a release additive are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a component, such as an active wafer, is temporarily bonded to a substrate, followed by further processing of the active wafer.

Compositions containing an adhesive material, a release additive and a copper passivation agent are suitable for temporarily bonding two surfaces, such as a semiconductor substrate active side and a carrier substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate having a copper surface is desired.

Method of releasably attaching a semiconductor substrate to a carrier

Arylcyclobutene polymers having improved toughness are provided. Compositions and methods for coating arylcyclobutene polymers having improved toughness are also provided.

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Charlestown, MA, United States of America

Mark S Oliver